The polymerization stability and the chemical stability and the water resistance of resin films are improved. A surfactant composition according to an embodiment contains a surfactant (A) represented by general formula (1) and an anionic surfactant (B) having a hydrophobic group different from that of the surfactant (A). In the formula, R.sup.1 represents one or two groups selected from groups below, D.sup.1 represents a polymerizable unsaturated group represented by chemical formula D.sup.1-1 or D.sup.1-2 below, R.sup.2 represents a hydrogen atom or a methyl group, m1 and m2 represent 1 to 2, A.sup.1 represents an alkylene group with 2 to 4 carbon atoms, and m3 represents 1 to 100. ##STR00001##

The polymerization stability and the chemical stability and the water resistance of resin films are improved. A surfactant composition according to an embodiment contains a surfactant (A) represented by general formula (1) and an anionic surfactant (B) having a hydrophobic group different from that of the surfactant (A). In the formula, R.sup.1 represents one or two groups selected from groups below, D.sup.1 represents a polymerizable unsaturated group represented by chemical formula D.sup.1-1 or D.sup.1-2 below, R.sup.2 represents a hydrogen atom or a methyl group, m1 and m2 represent 1 to 2, A.sup.1 represents an alkylene group with 2 to 4 carbon atoms, and m3 represents 1 to 100. ##STR00001##

A water based paint that can be used to form a superhydrophobic coating includes a fluorinated particulate filler, a water soluble or water suspendable resin, and an aqueous solvent. The superhydrophobic paint can be applied to a surface where the loss of the solvent results in a superhydrophobic coating.

Provided is a curable composition which is free of organotin compounds to be environmentally friendly and whose cured product shows high elongation and high elastic recovery to be suitable particularly as a sealant. The present invention relates to a curable composition containing a reactive silyl group-containing organic polymer (A) which has a highly active reactive silyl group at a molecular chain end, and a compound (B) having 2 to 10 ethyloxy groups in its molecule but having no amino group in its molecule, the compound (B) being a C1-C20 saturated hydrocarbon having one alkoxysilyl group, a C1-C20 hydrocarbon having two or more alkoxysilyl groups, or a C1-C20 polycarboxylic acid ester.

Provided are a polyamide resin composition prepared by blending a polyamide resin (A) and a polyalcohol (B), wherein the proportion of the number of the amide groups to the number of the carbon atoms in the polyamide resin (A) is 0.080 to 0.140 and the blending amount of the polyalcohol (B) is 1 to 10 parts by mass relative to 100 parts by mass of the polyamide resin (A); and a molded article of the resin composition.

Provided are a polyamide resin composition prepared by blending a polyamide resin (A) and a polyalcohol (B), wherein the proportion of the number of the amide groups to the number of the carbon atoms in the polyamide resin (A) is 0.080 to 0.140 and the blending amount of the polyalcohol (B) is 1 to 10 parts by mass relative to 100 parts by mass of the polyamide resin (A); and a molded article of the resin composition.

The present disclosure is drawn to polymeric photoactive agent, photo curable inks containing the polymeric photoactive agent, and methods of making the photo curable inks. The polymeric photoactive agent can include a xanthone analog modified with a polyether chain connecting to the xanthone analog through an ether linkage.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

Provided is a resin composition that is highly fluid and has good moldability, and that has excellent optical properties. More specifically, provided is a resin composition that contains a thermoplastic resin and a specific compounding agent containing a naphthalene structure and/or a fluorene structure.