A dielectric film for a film capacitor includes (A) a thermoplastic resin and (B) a metal diketone complex.

A dielectric film for a film capacitor includes (A) a thermoplastic resin and (B) a metal diketone complex.

A dielectric film for a film capacitor includes (A) a thermoplastic resin and (B) a metal diketone complex.

The present application relates to a cross-linkable composition. The present application can provide a cross-linkable composition without degradation of cross-linking efficiency while exhibiting conductivity by containing an ionic compound, and its use.

The present application relates to a cross-linkable composition. The present application can provide a cross-linkable composition without degradation of cross-linking efficiency while exhibiting conductivity by containing an ionic compound, and its use.

A crosslinking agent composition for water-compatible resins which comprises a hydrophobic crosslinking agent, a water-soluble organic compound, one or more oily media selected from among hydrocarbon-based solvents and ketone-based solvents having a solubility parameter of 9.0 (cal/cm.sup.−3).sup.1/2 or less, and an aqueous medium. The crosslinking agent composition can improve the storage stability of a water-compatible resin composition. The water-compatible resin composition which contains this crosslinking agent composition can give cured objects satisfactory in terms of water resistance and solvent resistance and is suitable also for use in wet-on-wet coating.

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (4):

[A]: epoxy resin
[B]: aromatic diamine
[C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): the ratio H/E between the amount by mole, E, of the epoxy group in the component [A] and the amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less. (2): at least a part of the component [C] satisfies 0.10 or more and 0.60 or less in a ratio m/M of a molecular weight m thereof to a theoretical molecular weight between crosslinking points, M, of a cured product of the epoxy resin composition. (3): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (2) is 0.01 or more and 0.20 or less; and (4): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (4):

[A]: epoxy resin
[B]: aromatic diamine
[C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): the ratio H/E between the amount by mole, E, of the epoxy group in the component [A] and the amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less. (2): at least a part of the component [C] satisfies 0.10 or more and 0.60 or less in a ratio m/M of a molecular weight m thereof to a theoretical molecular weight between crosslinking points, M, of a cured product of the epoxy resin composition. (3): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (2) is 0.01 or more and 0.20 or less; and (4): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

An insulating resin includes (A) a thermoplastic resin and (B) a metal diketone complex.

An insulating resin includes (A) a thermoplastic resin and (B) a metal diketone complex.