A polymeric matrix including: 50 to 80%, preferably 64 to 73% PET; 18 to 50%, preferably 20 to 28% of a mixture of polyolefins; 0.1 to 15%, preferably 0.5 to 7% of at least one flame-retardant additive; 0 to 2%, preferably 0.2 to 1% of at least one antioxidant; 0 to 2% preferably 0.2 to 1% of at least one crosslinking promoter; 0 to 2%, preferably 0.2 to 1% of at least one anti-hydrolysis agent, the percentages being by weight of the total weight of the matrix. Also, the use of polymeric matrix in manufacturing electrical cables.

A polymeric matrix including: 50 to 80%, preferably 64 to 73% PET; 18 to 50%, preferably 20 to 28% of a mixture of polyolefins; 0.1 to 15%, preferably 0.5 to 7% of at least one flame-retardant additive; 0 to 2%, preferably 0.2 to 1% of at least one antioxidant; 0 to 2% preferably 0.2 to 1% of at least one crosslinking promoter; 0 to 2%, preferably 0.2 to 1% of at least one anti-hydrolysis agent, the percentages being by weight of the total weight of the matrix. Also, the use of polymeric matrix in manufacturing electrical cables.

The present invention provides compounds of formula ##STR00001##
a process for their preparation, a solution comprising these compounds, a process for the preparation of a device using the solution, devices obtainable by the process and the use of the bis-azide-type compounds as cross-linkers.

The present invention provides compounds of formula ##STR00001##
a process for their preparation, a solution comprising these compounds, a process for the preparation of a device using the solution, devices obtainable by the process and the use of the bis-azide-type compounds as cross-linkers.

Impact copolymer (ICP) compositions may include those having a melt strength (MS) and melt flow rate (MFR) described according to the formula: MS≥325×MFR.sup.−1.7, wherein the MS is greater than 1 cN. Methods of producing an impact copolymer (ICP) composition may include coupling the ICP composition with a coupling agent, wherein the ICP composition includes a matrix polymer and a dispersed component; wherein the ICP composition possesses a measurable melt strength (MS) and melt flow rate (MFR) satisfying the equation: MS≥325×MFR.sup.−1.7, wherein the MS is greater than 1 cN.

Impact copolymer (ICP) compositions may include those having a melt strength (MS) and melt flow rate (MFR) described according to the formula: MS≥325×MFR.sup.−1.7, wherein the MS is greater than 1 cN. Methods of producing an impact copolymer (ICP) composition may include coupling the ICP composition with a coupling agent, wherein the ICP composition includes a matrix polymer and a dispersed component; wherein the ICP composition possesses a measurable melt strength (MS) and melt flow rate (MFR) satisfying the equation: MS≥325×MFR.sup.−1.7, wherein the MS is greater than 1 cN.

A curable precursor composition for a fluoroelastomers, methods of making fluoroelastomers, shaped articles and methods of making shaped articles.

To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A), wherein the polysiloxane (A) is a polysiloxane represented by the general formula (1), and wherein (X) and (Y) are represented by the general formulas (4) to (6).

7.5≦(X)≦75  (4)

2.5≦(Y)≦40  (5)

1.5×(Y)≦(X)≦3×(Y)  (6)

##STR00001##

A cross-linking moiety having a general formula I: Ar.sub.F-W, wherein Ar.sub.F comprises a fluorinated phenyl azide group having at least one non-fluorine substituent that is bulkier than fluorine at a meta position relative to the azide group, and W comprises an electron-withdrawing group.

The present invention relates to the use of a mono-azide compound for cross-linking polymer strands, wherein said mono-azide compound has a structure of the formula (I): (I), wherein Q.sup.1 and Q.sup.2 are each independently from another a halogen and wherein R.sup.1, R.sup.2 and R.sup.3 are each independently from another any not comprising an azido moiety. Further, the present invention relates to a method for cross-linking polymer stands and to a cross-linked polymer composition obtainable from said method and an electronic device comprising such composition.

##STR00001##