Disclosed herein is a A polyalkanolamine including the structure of formula L1

[00001]${\left[{\text{A}}^{\text{L}}\right]}_{\text{n}}{\left[{\text{B}}^{\text{L}}\right]}_{\text{m}}$

wherein A.sup.L is B.sup.L is X.sup.L1, X.sup.L2, X.sup.L3 are independently selected from a C.sub.1 to C.sub.6 alkanediyl; Ar.sup.L is a 5 or 6 membered N-heteroaromatic ring system including from 1 to 4 N atoms, which may be unsubstituted or substituted by C.sub.1 to C.sub.6 alkyl; n is an integer of from 2 to 350; m is 0 or an integer of from 1 to 600; o is 1 or an integer of from 2 to 25; B.sup.L1 is a continuation of the backbone B.sup.L by branching; X.sup.L11, X.sup.L12, X.sup.L13 are independently selected from a C.sub.1 to C.sub.6 alkanediyl; X.sup.L21 is a C.sub.1 to C.sub.6 alkanediyl; and derivatives thereof obtainable by N-protonation, N-quaternization, substitution, or polyalkoxylation.

Disclosed herein is a A polyalkanolamine including the structure of formula L1

[00001]${\left[{\text{A}}^{\text{L}}\right]}_{\text{n}}{\left[{\text{B}}^{\text{L}}\right]}_{\text{m}}$

wherein A.sup.L is B.sup.L is X.sup.L1, X.sup.L2, X.sup.L3 are independently selected from a C.sub.1 to C.sub.6 alkanediyl; Ar.sup.L is a 5 or 6 membered N-heteroaromatic ring system including from 1 to 4 N atoms, which may be unsubstituted or substituted by C.sub.1 to C.sub.6 alkyl; n is an integer of from 2 to 350; m is 0 or an integer of from 1 to 600; o is 1 or an integer of from 2 to 25; B.sup.L1 is a continuation of the backbone B.sup.L by branching; X.sup.L11, X.sup.L12, X.sup.L13 are independently selected from a C.sub.1 to C.sub.6 alkanediyl; X.sup.L21 is a C.sub.1 to C.sub.6 alkanediyl; and derivatives thereof obtainable by N-protonation, N-quaternization, substitution, or polyalkoxylation.

A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.

A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.

The present invention provides a methacrylic resin composition comprising 100 parts by mass of a methacrylic resin comprising 50 to 97% by mass of a methacrylic acid ester monomer unit (A), 3 to 30% by mass of a structural unit (B) having a ring structure in the backbone, and 0 to 20% by mass of an additional vinyl monomer unit (C) copolymerizable with a methacrylic acid ester monomer, and 0.001 to 0.2 parts by mass of a compound (D) having a predetermined structure, the methacrylic resin composition satisfying the following conditions (I) and (II):
(I): a weight-average molecular weight of the methacrylic resin composition as measured by gel permeation chromatography (GPC) is 65,000 to 300,000, and
(II): a mass ratio between the component (D) and the structural unit (B) having a ring structure in the backbone is 25≤(B)/(D)≤1000.

The present invention provides a methacrylic resin composition comprising 100 parts by mass of a methacrylic resin comprising 50 to 97% by mass of a methacrylic acid ester monomer unit (A), 3 to 30% by mass of a structural unit (B) having a ring structure in the backbone, and 0 to 20% by mass of an additional vinyl monomer unit (C) copolymerizable with a methacrylic acid ester monomer, and 0.001 to 0.2 parts by mass of a compound (D) having a predetermined structure, the methacrylic resin composition satisfying the following conditions (I) and (II):
(I): a weight-average molecular weight of the methacrylic resin composition as measured by gel permeation chromatography (GPC) is 65,000 to 300,000, and
(II): a mass ratio between the component (D) and the structural unit (B) having a ring structure in the backbone is 25≤(B)/(D)≤1000.

The present invention provides a methacrylic resin composition comprising 100 parts by mass of a methacrylic resin comprising 50 to 97% by mass of a methacrylic acid ester monomer unit (A), 3 to 30% by mass of a structural unit (B) having a ring structure in the backbone, and 0 to 20% by mass of an additional vinyl monomer unit (C) copolymerizable with a methacrylic acid ester monomer, and 0.001 to 0.2 parts by mass of a compound (D) having a predetermined structure, the methacrylic resin composition satisfying the following conditions (I) and (II):
(I): a weight-average molecular weight of the methacrylic resin composition as measured by gel permeation chromatography (GPC) is 65,000 to 300,000, and
(II): a mass ratio between the component (D) and the structural unit (B) having a ring structure in the backbone is 25≤(B)/(D)≤1000.

A salt-forming compound represented by the following general formula (3): ##STR00001##
where X.sup.1 and X.sup.2 each independently represent an aromatic ring group optionally containing a substituent; Y represents a divalent hydrocarbon group that the carbon atom directly bound to X.sup.1 or X.sup.2 does not have a π bond; Z.sup.+ represents an organic cation group; e represents an integer of from 1 to 4; and when e is 2 or more, a plurality of Ys and a plurality of Z.sup.+ s may be each the same or different; A.sup.c- represents a heteropolyoxometalate anion which is a c-valent anion and which has an oxidation-reduction potential larger than −0.3 V relative to the silver/silver chloride electrode; f and c are each an integer of 2 or more; g is an integer of 1 or more; and the salt-forming compound is a normal salt that f×e=c×g.

A polyimide copolymer according to the present invention has a particular structure in which siloxane structures are distributed in a nanosize in a polymer and thus enables excellent transparency, heat resistance, mechanical strength and flexibility and effective reduction of residual stress, and thus can be used in various fields such as a substrate for a device, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), tape, a touch panel and a protective film for an optical disk.

A polyimide copolymer according to the present invention has a particular structure in which siloxane structures are distributed in a nanosize in a polymer and thus enables excellent transparency, heat resistance, mechanical strength and flexibility and effective reduction of residual stress, and thus can be used in various fields such as a substrate for a device, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), tape, a touch panel and a protective film for an optical disk.