The present invention describes compounds and uses thereof in applications relating to absorption of electromagnetic energy. Preferred compounds are double bond-containing compounds capable of absorbing electromagnetic radiation energy and having improved properties.

The present invention describes compounds and uses thereof in applications relating to absorption of electromagnetic energy. Preferred compounds are double bond-containing compounds capable of absorbing electromagnetic radiation energy and having improved properties.

Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

A decrease in molecular weight in molding of a polyamide is suppressed. A polyamide resin composition of the present invention includes: a polyamide having a structural unit containing an alkylene group having 1 to 3 carbon atoms and an amide bond; and a compound having a cyclic structure in which first nitrogen and second nitrogen of a carbodiimide group are bonded by a bonding group. A molded polyamide resin article is produced by molding of the polyamide resin composition through heat pressurization.

A decrease in molecular weight in molding of a polyamide is suppressed. A polyamide resin composition of the present invention includes: a polyamide having a structural unit containing an alkylene group having 1 to 3 carbon atoms and an amide bond; and a compound having a cyclic structure in which first nitrogen and second nitrogen of a carbodiimide group are bonded by a bonding group. A molded polyamide resin article is produced by molding of the polyamide resin composition through heat pressurization.

A polyester film containing a polyester support having a terminal carboxylic acid value of from 3 to 20 eq/ton and IV of from 0.65 to 0.9 dL/g, and a conductive layer having a surface specific resistance of from 10.sup.6 to 10.sup.14Ω per square with an in-plane distribution of from 0.1 to 20% exhibits an improvement in withstand voltage.

A polyester film containing a polyester support having a terminal carboxylic acid value of from 3 to 20 eq/ton and IV of from 0.65 to 0.9 dL/g, and a conductive layer having a surface specific resistance of from 10.sup.6 to 10.sup.14Ω per square with an in-plane distribution of from 0.1 to 20% exhibits an improvement in withstand voltage.

The present invention relates to a modifier represented by Formula 1, a method of preparing the same, a modified conjugated diene-based polymer having a high modification ratio which includes a modifier-derived functional group, and a method of preparing the polymer.

The invention relates to a use of at least one condensation product (A) in the form of the free compound or in the form of a salt of at least one acid as a thixotropy-increasing additive, which condensation product can be obtained by reacting at least one polymerized fatty acid or at least one reaction product (U) of at least two polymerized fatty acids and at least one polyamine having at least two primary amino groups as component (a1) with at least one polyalkylene polyamine, which is capable of forming at least one imidazoline and/or tetrahydropyrimidine unit and which has at least two primary amino groups or at least one primary and at least one secondary amino group, a composition containing at least one such condensation product (A) and at least one thixotropic agent (B), and a use of said composition, which additionally comprises at least one binder (C), as an adhesive, sealant, paint, coating agent, adhesive resin, casting resin, artificial marble, floor covering, polymer concrete, or fiber composite material.