C08K5/34924

Non-Polar Ethylene-Based Compositions with Triallyl Phosphate for Encapsulant Films

An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer having a density of 0.850 g/cc to 0.890 g/cc; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising triallyl phosphate.

Non-Polar Ethylene-Based Compositions with Triallyl Phosphate for Encapsulant Films

An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer having a density of 0.850 g/cc to 0.890 g/cc; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising triallyl phosphate.

COATING FOR FORMING CONDUCTIVE RELEASE LAYER, METHOD FOR PRODUCING SAME, CONDUCTIVE RELEASE FILM, AND METHOD FOR PRODUCING SAME
20180010017 · 2018-01-11 ·

Provided is a coating for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

Co-cured fluoroelastomers with improved chemical resistance

Co-cured blends of fluoroelastomers of tetrafluoroethylene-propylene copolymer with cure site monomer and terpolymers of Vinylidene fluoride (VDF), Hexafluoropropylene (HFP) and Tetrafluoroethylene (TFE) with peroxide as initiator and coagent TAIC as crosslinker show improved curing performance, improved mechanical properties and improved compression set as well. The co-cured fluoroelastomers show improved chemical resistance to the solvent aging systems and better retention of mechanical properties after aging at high temperature in the solvents system.

Co-cured fluoroelastomers with improved chemical resistance

Co-cured blends of fluoroelastomers of tetrafluoroethylene-propylene copolymer with cure site monomer and terpolymers of Vinylidene fluoride (VDF), Hexafluoropropylene (HFP) and Tetrafluoroethylene (TFE) with peroxide as initiator and coagent TAIC as crosslinker show improved curing performance, improved mechanical properties and improved compression set as well. The co-cured fluoroelastomers show improved chemical resistance to the solvent aging systems and better retention of mechanical properties after aging at high temperature in the solvents system.

POLYAMIDE COMPOSITE AND PREPARATION METHOD THEREOF

The present invention provides a polyamide composite, including the following components: 20 to 80 parts of a polyamide resin; 1 to 30 parts of a red phosphorus flame retardant; 0.01 to 10 parts of trimethallyl isocyanurate; and the polyamide composite has a cross-linked structure between polyamide molecules. By adding trimethallyl isocyanurate (TMAIC) for irradiation cross-linking treatment, and by the red phosphorus flame retardant, not only the polyamide composite can meet the needs of flame retardant, but also glow-wire ignition temperature (GWIT) and comparative tracking index (CTI) have been improved.

POLYAMIDE COMPOSITE AND PREPARATION METHOD THEREOF

The present invention provides a polyamide composite, including the following components: 20 to 80 parts of a polyamide resin; 1 to 30 parts of a red phosphorus flame retardant; 0.01 to 10 parts of trimethallyl isocyanurate; and the polyamide composite has a cross-linked structure between polyamide molecules. By adding trimethallyl isocyanurate (TMAIC) for irradiation cross-linking treatment, and by the red phosphorus flame retardant, not only the polyamide composite can meet the needs of flame retardant, but also glow-wire ignition temperature (GWIT) and comparative tracking index (CTI) have been improved.

FLAME RETARDANT-STABILIZER COMBINATION FOR THERMOPLASTIC POLYMERS
20230227629 · 2023-07-20 · ·

The invention provides a flame retardant-stabilizer combination for thermoplastic polymers, comprising as component A 20% to 99.7% by weight of phosphinic salt of the formula (I), (I), in which R.sub.1 and R.sub.2 are each ethyl, M is Al and m is 3; as component B 0.2% to 16% by weight of aluminium salts of ethylbutylphosphinic acid, of dibutylphosphinic acid, of ethylhexylphosphinic acid, of butylhexylphosphinic acid and/or of dihexylphosphinic acid; as component C 0.1% to 80% by weight of a salt of phosphorous acid having the general formula (II) [HP(═O)O.sub.2].sup.2−M.sup.m+(II) in which M is Zn and m is 2; as component D 0% to 80% by weight of a salt of phosphorous acid having the general formula (III) [HP(═O)O.sub.2].sup.2−.sub.3 M.sup.m+.sub.2 (III) in which M is Al and m is 3; as component E 0% to 30% by weight of a nitrogen-containing synergist and/or of a phosphorus-containing and/or nitrogen-containing flame retardant; as component F 0% to 10% by weight of an inorganic synergist selected from zinc borate, zinc stannate, boehmite and/or hydrotalcite; as component G 0% to 3% by weight of an organic phosphonite and/or a mixture of an organic phosphonite and an organic phosphite and as component H 0% to 3% by weight of an ester and/or salt of long-chain aliphatic carboxylic acids (fatty acids) typically having chain lengths of C.sub.14 to C.sub.40, where the sum total of the components is always 100% by weight.

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Flame retardant and stabilizer combined for use with thermoplastics
20230227628 · 2023-07-20 · ·

The present disclosure relates to a novel flame retardant and stabilizer additive composition for thermoplastic polymers, the additive composition including at least one phosphorus-containing flame retardant and at least one carbodiimide, as described herein. The presently disclosed additive compositions are useful over a wide range of thermoplastic applications, particularly in thermoplastic polymers that are processed and/or used at high temperatures.

Resin composition and use thereof

This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C.sub.6-C.sub.20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.