The invention is related to a method for reducing the emission of acetaldehyde and/or propionaldehyde from a polyurethane or polyurea foam, by using a reaction mixture comprising at least one isocyanate reactive component selected from the group consisting of a polyether polyol, a polyester polyol, a polyether polyamine and a polyester polyamine; an isocyanate component; and cyanoacetamide.

A room-temperature-curable organopolysiloxane composition; a structure obtained from the composition; and a method for assessing the cured state of the composition are provided. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1)
HO(SiR.sub.2O).sub.nH  (1)
and/or formula (2) ##STR00001##
(with variables as defined herein); (B) 0.1-50 parts by mass of an organosilicon compound having at least three silicon-atom-bonded hydrolyzable groups in the molecule, which is not any of ingredients (A), (C), and (D), and/or a product of the partial hydrolytic condensation of the organosilicon compound; (C) 0.01-20 parts by mass of a curing catalyst; (D) 0.1-10 parts by mass of a silane coupling agent; and (E) 0.01-10 parts by mass of a pH indicator.

A room-temperature-curable organopolysiloxane composition; a structure obtained from the composition; and a method for assessing the cured state of the composition are provided. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1)
HO(SiR.sub.2O).sub.nH  (1)
and/or formula (2) ##STR00001##
(with variables as defined herein); (B) 0.1-50 parts by mass of an organosilicon compound having at least three silicon-atom-bonded hydrolyzable groups in the molecule, which is not any of ingredients (A), (C), and (D), and/or a product of the partial hydrolytic condensation of the organosilicon compound; (C) 0.01-20 parts by mass of a curing catalyst; (D) 0.1-10 parts by mass of a silane coupling agent; and (E) 0.01-10 parts by mass of a pH indicator.

A decrease in molecular weight in molding of a polyamide is suppressed. A polyamide resin composition of the present invention includes: a polyamide having a structural unit containing an alkylene group having 1 to 3 carbon atoms and an amide bond; and a compound having a cyclic structure in which first nitrogen and second nitrogen of a carbodiimide group are bonded by a bonding group. A molded polyamide resin article is produced by molding of the polyamide resin composition through heat pressurization.

A decrease in molecular weight in molding of a polyamide is suppressed. A polyamide resin composition of the present invention includes: a polyamide having a structural unit containing an alkylene group having 1 to 3 carbon atoms and an amide bond; and a compound having a cyclic structure in which first nitrogen and second nitrogen of a carbodiimide group are bonded by a bonding group. A molded polyamide resin article is produced by molding of the polyamide resin composition through heat pressurization.

An aqueous coating material composition, includes: a polyolefin resin aqueous dispersion (A) containing a polypropylene (a1); a crosslinking agent (B) having a functional group that reacts with a carboxyl group; and a polyester resin aqueous dispersion (C) having a resin acid value of 3 mgKOH/g to 100 mgKOH/g, and with respect to a total solid content of the polyolefin resin aqueous dispersion (A), a solid content of the crosslinking agent (B) is 0.1 mass % to 20 mass %, and a solid content of the polyester resin aqueous dispersion (C) is 0.5 mass % to 30 mass %.

An aqueous coating material composition, includes: a polyolefin resin aqueous dispersion (A) containing a polypropylene (a1); a crosslinking agent (B) having a functional group that reacts with a carboxyl group; and a polyester resin aqueous dispersion (C) having a resin acid value of 3 mgKOH/g to 100 mgKOH/g, and with respect to a total solid content of the polyolefin resin aqueous dispersion (A), a solid content of the crosslinking agent (B) is 0.1 mass % to 20 mass %, and a solid content of the polyester resin aqueous dispersion (C) is 0.5 mass % to 30 mass %.

An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.

An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.

A plasticized PVC composition free of phthalate and having low color is disclosed. The composition comprises a morpholide plasticizer prepared from a fatty acid selected from a tall oil fatty acid, a tall oil fatty acid monomer derived therefrom, and mixtures thereof. The fatty acid has a total carbon footprint of <95% of the total carbon footprint of a fatty acid obtained from a vegetable oil. The morpholide is prepared from the reaction of a tall oil fatty acid with morpholine in the presence of a catalyst.