A radical-polymerizable resin composition comprising one or more metal-containing compounds (A) selected from a metal soap (A1) and a β-diketone skeleton-containing metal complex (A2); one or more thiol compounds (B) selected from a secondary thiol compound (B1) and a tertiary thiol compound (B2); and a radical-polymerizable compound (C) can stably cure under a dry condition, in water and in seawater and further on a wet substrate. The radical-polymerizable resin composition is useful as a repairing material for inorganic structure, a radical-polymerizable coating composition, a concrete spall preventing curable material, a reinforcing fiber-containing composite material, etc.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R.sup.1 represents a hydrogen atom, or the like; R.sup.2 represents a hydrogen atom or the like; and R.sup.3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar.sup.1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R.sup.4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R.sup.5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like.

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Provided is a hard coating film in which a hard coating layer having a water contact angle of 90° or less, a high refractive index layer, and a low refractive index layer are laminated on a substrate, the film having suppressed curling, and excellent hardness and antireflection performance.

Provided is a hard coating film in which a hard coating layer having a water contact angle of 90° or less, a high refractive index layer, and a low refractive index layer are laminated on a substrate, the film having suppressed curling, and excellent hardness and antireflection performance.

The present invention relates to covalent adaptable networks (CANs) having exchangeable crosslinks that are able to undergo repeated covalent bond reshuffling through photo-activation at ambient temperatures. The invention provides covalent adaptable network forming compositions as well as methods of forming, remolding and recycling the CANs of the invention.

The present invention relates to a UV curable silicone composition comprising at least one organopolysiloxane having at least two alkenyl groups per molecule; at least one mercapto functional organic compound having at least two thiol groups per molecule; at least one photopolymerization initiator; and at least one polymerization inhibitor comprising at least one alkoxylated polyol derived (meth)acrylate or at least one quinone derivative compound, and/or at least one antioxidant, wherein the composition comprises the photopolymerization initiator selected from intramolecular hydrogen abstraction type photopolymerization initiators, or the composition comprises the polymerization inhibitor.

The present invention relates to a UV curable silicone composition comprising at least one organopolysiloxane having at least two alkenyl groups per molecule; at least one mercapto functional organic compound having at least two thiol groups per molecule; at least one photopolymerization initiator; and at least one polymerization inhibitor comprising at least one alkoxylated polyol derived (meth)acrylate or at least one quinone derivative compound, and/or at least one antioxidant, wherein the composition comprises the photopolymerization initiator selected from intramolecular hydrogen abstraction type photopolymerization initiators, or the composition comprises the polymerization inhibitor.

The invention provides a thermoplastic resin composition having (A) a thermoplastic polymer comprising (a1) 5 mass % to less than 50 mass % of a propylene polymer having a melting point of 150° C. or higher, (a2) 10 mass % to less than 60 mass % of an ethylene polymer, (a3) 5 mass % to less than 50 mass % of, for example, a hydrogenated product of a block copolymer of an aromatic vinyl compound and a conjugated diene compound, and (a4) 1 mass % to less than 30 mass % of, for example, an unsaturated carboxylic acid-modified olefin polymer; (B) a softener for nonaromatic rubbers; (C) a metal hydrate; (D) an organic peroxide; (E) an antioxidant; and (F) a coupling agent.