Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

[Problem] To contribute to SDGs by making it possible to provide a (semi-)transparent clear file with sufficient durability [Means for Solving] A (semi-)transparent clear file of the present invention comprises (semi-)transparent covering paper P in which at least one surface of raw material paper R is covered with a cured product of a resin composition L. The resin composition L contains an energy ray polymerizable (meth)acrylic monomer and/or oligomer having a viscosity at 25° C. of 100 mPa.Math.s or less, and glass transition temperature Tg of the cured product of 50° C. or higher. A basis weight of the paper is 65 g/m.sup.2 or more and 100 g/cm.sup.2 or less. The paper has a thickness of 80 μm or more and 100 μm or less. A proportion of the paper to 100 pts. mass of the covering paper P is 50 pts. mass or more, and a proportion of the cured product is less than 50 pts. mass. The monomer and/or the oligomer are/is preferably alkali-soluble, and also preferably contain/contains an inert resin. The raw material paper R is preferably uncoated paper.

Provided are a polyamide resin with a high melting point and a high glass transition temperature, a polyamide resin composition, and a molded article. The polyamide resin includes diamine-derived structural units and dicarboxylic acid-derived structural units, in which 50 mol % or more of the diamine-derived structural units are structural units derived from p-benzenediethanamine, and 65 mol % or more of the dicarboxylic acid-derived structural units are structural units derived from an aromatic dicarboxylic acid.

Provided are a polyamide resin with a high melting point and a high glass transition temperature, a polyamide resin composition, and a molded article. The polyamide resin includes diamine-derived structural units and dicarboxylic acid-derived structural units, in which 50 mol % or more of the diamine-derived structural units are structural units derived from p-benzenediethanamine, and 65 mol % or more of the dicarboxylic acid-derived structural units are structural units derived from an aromatic dicarboxylic acid.

Provided are a polyamide resin composition containing 100 parts by mass of a specific polyamide (A), 45 to 120 parts by mass of an inorganic fibrous reinforcing material (B), 25 to 40 parts by mass of at least one phosphinate salt (C) represented by a specific formula, and 2 to 15 parts by mass of a phosphite salt (D), the phosphinate salt (C) and the phosphite salt (D) being contained at a specific ratio, and a molded object of the polyamide resin composition.

Provided are a polyamide resin composition containing 100 parts by mass of a specific polyamide (A), 45 to 120 parts by mass of an inorganic fibrous reinforcing material (B), 25 to 40 parts by mass of at least one phosphinate salt (C) represented by a specific formula, and 2 to 15 parts by mass of a phosphite salt (D), the phosphinate salt (C) and the phosphite salt (D) being contained at a specific ratio, and a molded object of the polyamide resin composition.

The invention provides a flame retardant-stabilizer combination for thermoplastic polymers, comprising as component A 20% to 99.7% by weight of phosphinic salt of the formula (I), (I), in which R.sub.1 and R.sub.2 are each ethyl, M is Al and m is 3; as component B 0.2% to 16% by weight of aluminium salts of ethylbutylphosphinic acid, of dibutylphosphinic acid, of ethylhexylphosphinic acid, of butylhexylphosphinic acid and/or of dihexylphosphinic acid; as component C 0.1% to 80% by weight of a salt of phosphorous acid having the general formula (II) [HP(═O)O.sub.2].sup.2−M.sup.m+(II) in which M is Zn and m is 2; as component D 0% to 80% by weight of a salt of phosphorous acid having the general formula (III) [HP(═O)O.sub.2].sup.2−.sub.3 M.sup.m+.sub.2 (III) in which M is Al and m is 3; as component E 0% to 30% by weight of a nitrogen-containing synergist and/or of a phosphorus-containing and/or nitrogen-containing flame retardant; as component F 0% to 10% by weight of an inorganic synergist selected from zinc borate, zinc stannate, boehmite and/or hydrotalcite; as component G 0% to 3% by weight of an organic phosphonite and/or a mixture of an organic phosphonite and an organic phosphite and as component H 0% to 3% by weight of an ester and/or salt of long-chain aliphatic carboxylic acids (fatty acids) typically having chain lengths of C.sub.14 to C.sub.40, where the sum total of the components is always 100% by weight.

##STR00001##

The invention provides a flame retardant-stabilizer combination for thermoplastic polymers, comprising as component A 20% to 99.7% by weight of phosphinic salt of the formula (I), (I), in which R.sub.1 and R.sub.2 are each ethyl, M is Al and m is 3; as component B 0.2% to 16% by weight of aluminium salts of ethylbutylphosphinic acid, of dibutylphosphinic acid, of ethylhexylphosphinic acid, of butylhexylphosphinic acid and/or of dihexylphosphinic acid; as component C 0.1% to 80% by weight of a salt of phosphorous acid having the general formula (II) [HP(═O)O.sub.2].sup.2−M.sup.m+(II) in which M is Zn and m is 2; as component D 0% to 80% by weight of a salt of phosphorous acid having the general formula (III) [HP(═O)O.sub.2].sup.2−.sub.3 M.sup.m+.sub.2 (III) in which M is Al and m is 3; as component E 0% to 30% by weight of a nitrogen-containing synergist and/or of a phosphorus-containing and/or nitrogen-containing flame retardant; as component F 0% to 10% by weight of an inorganic synergist selected from zinc borate, zinc stannate, boehmite and/or hydrotalcite; as component G 0% to 3% by weight of an organic phosphonite and/or a mixture of an organic phosphonite and an organic phosphite and as component H 0% to 3% by weight of an ester and/or salt of long-chain aliphatic carboxylic acids (fatty acids) typically having chain lengths of C.sub.14 to C.sub.40, where the sum total of the components is always 100% by weight.

##STR00001##