Patent classifications
C08K7/16
POLYMER COMPOSITION
A polymer composition for impregnating a high temperature superconductor (HTS) coil, the composition comprising: a polymer resin, a plurality of particles of a first filler material, and a plurality of particles of a second filler material; wherein the median particle size of the second filler material is less than the median particle size of the first filler material. The polymer composition may be used to prepare a polymer impregnated HTS coil having a predetermined turn-to-turn spacing. A property of the polymer composition may also be modified, for example, the coefficient of thermal contraction and/or resistivity of the composition. Also disclosed is a polymer impregnated HTS coil and a method for preparing the coil.
ELECTRO-POLARIZABLE PARTICLE, PREPARATION METHOD THEREOF, AND ELECTRO-POLARIZABLE ALLOCHROIC OPTICAL FILM
The present application relates to electro-polarizable particle, a preparation method thereof and an electro-polarizable allochroic optical film, belonging to the technical field of electro-polarizable allochroic optical film devices. The present application discloses electro-polarizable particle, whose raw materials include a metal iodide, a carboxylic acid nitrogenous organic molecule, iodine and a cellulose suspending agent; the electro-polarizable particle have a rod-shaped structure, a length of 100-2000 nm, and a width of 10-200 nm. The present application further discloses a preparation method for electro-polarizable particle, and also discloses an electro-polarizable allochroic optical film containing the electro-polarizable particle.
ELECTRO-POLARIZABLE PARTICLE, PREPARATION METHOD THEREOF, AND ELECTRO-POLARIZABLE ALLOCHROIC OPTICAL FILM
The present application relates to electro-polarizable particle, a preparation method thereof and an electro-polarizable allochroic optical film, belonging to the technical field of electro-polarizable allochroic optical film devices. The present application discloses electro-polarizable particle, whose raw materials include a metal iodide, a carboxylic acid nitrogenous organic molecule, iodine and a cellulose suspending agent; the electro-polarizable particle have a rod-shaped structure, a length of 100-2000 nm, and a width of 10-200 nm. The present application further discloses a preparation method for electro-polarizable particle, and also discloses an electro-polarizable allochroic optical film containing the electro-polarizable particle.
CONDUCTIVE RESIN COMPOSITION
A conductive resin composition has low-temperature curability and is excellent in resistance stability during stretching. A conductive resin composition contains: (A) a polyorganosiloxane having an alkenyl group, (B) a polyorganosiloxane having a specific structure, (C) a conductive particle, (D) a compound having a hydrosilyl group, and (E) a hydrosilylation catalyst.
The content of the component (B) is 6 to 50 parts by mass based on 100 parts by mass of the component (A).
ANTIMICROBIAL COMPOSITION HAVING EXCELLENT ANTIMICROBIAL PROPERTY AND IMPROVED CHEMICAL RESISTANCE, AND MOLDED ARTICLE INCLUDING SAME
Disclosed are an antimicrobial composition having excellent antimicrobial and anti-fungal properties and improved fingerprint resistance and chemical resistance, and a molded article including the same. The antimicrobial composition includes a combination of an amount of about 45 to 85 wt % of a polycarbonate resin, an amount of about 10 to 36 wt % of a polyester resin, an amount of about 3 to 12 wt % of an impact modifier, an amount of about 0.2 to 2 wt % of an inorganic antimicrobial agent, and an amount of about 1 to 6 wt % of a micro powder including a fluorine-based polymer resin, based on the total weight of the antimicrobial composition.
ANTIMICROBIAL COMPOSITION HAVING EXCELLENT ANTIMICROBIAL PROPERTY AND IMPROVED CHEMICAL RESISTANCE, AND MOLDED ARTICLE INCLUDING SAME
Disclosed are an antimicrobial composition having excellent antimicrobial and anti-fungal properties and improved fingerprint resistance and chemical resistance, and a molded article including the same. The antimicrobial composition includes a combination of an amount of about 45 to 85 wt % of a polycarbonate resin, an amount of about 10 to 36 wt % of a polyester resin, an amount of about 3 to 12 wt % of an impact modifier, an amount of about 0.2 to 2 wt % of an inorganic antimicrobial agent, and an amount of about 1 to 6 wt % of a micro powder including a fluorine-based polymer resin, based on the total weight of the antimicrobial composition.
Planographic printing plate precursor, planographic printing plate precursor laminate, plate-making method for planographic printing plate, and planographic printing method
Provided are a planographic printing plate precursor including an aluminum support, and an image recording layer and a protective layer which are provided on the aluminum support in this order, in which a thickness of the protective layer is 0.2 μm or greater, and Expression (1) is satisfied in a case where a Bekk smoothness of a surface of an outermost layer on a side opposite to a side where the image recording layer is provided is denoted by b seconds; a planographic printing plate precursor laminate; a plate-making method for a planographic printing plate; and a planographic printing method.
RF HEAT DISSIPATION PLASITC AND REPEATER CABINET IMPLEMENTED BY INCLUDING SAME
Provided is an RF heat dissipation plastic. The heat dissipation plastic according to one embodiment of the present invention is implemented by including: a polymer matrix comprising a base resin; and hollow first fillers dispersed in the polymer matrix. Accordingly, the RF heat dissipation plastic has the advantageous effect of simultaneously exhibiting low permittivity and excellent mechanical strength due to the hollow fillers included therein. In addition, despite the low permittivity and excellent mechanical strength designed for the RF heat dissipation plastic, the RF heat dissipation plastic exhibits excellent heat dissipation performance due to non-hollow fillers included therein, which exhibit heat dissipation performance. According to the present invention, the RF heat dissipation plastic exhibiting the low permittivity and the excellent mechanical strength and heat dissipation performance can minimize performance degradation or functional loss of a repeater cabinet which may be affected by transmission and reception of high-frequency band signals according to permittivity, and thus can be widely applied to various products across all industries.
RF HEAT DISSIPATION PLASITC AND REPEATER CABINET IMPLEMENTED BY INCLUDING SAME
Provided is an RF heat dissipation plastic. The heat dissipation plastic according to one embodiment of the present invention is implemented by including: a polymer matrix comprising a base resin; and hollow first fillers dispersed in the polymer matrix. Accordingly, the RF heat dissipation plastic has the advantageous effect of simultaneously exhibiting low permittivity and excellent mechanical strength due to the hollow fillers included therein. In addition, despite the low permittivity and excellent mechanical strength designed for the RF heat dissipation plastic, the RF heat dissipation plastic exhibits excellent heat dissipation performance due to non-hollow fillers included therein, which exhibit heat dissipation performance. According to the present invention, the RF heat dissipation plastic exhibiting the low permittivity and the excellent mechanical strength and heat dissipation performance can minimize performance degradation or functional loss of a repeater cabinet which may be affected by transmission and reception of high-frequency band signals according to permittivity, and thus can be widely applied to various products across all industries.
MATTE POLYCARBONATE COMPOSITIONS, ARTICLES AND METHOD TO MAKE THEM
A polycarbonate article is described that is formed from a thermoplastic composition comprised of a polycarbonate or polycarbonate copolymer; and at least 1% by weight of a polysilsesquioxane (PSQ) solid particles that have a decomposition temperature of at least 350° C. and an acicular filler, which desirably has an aspect ratio of 2 to 50. The PSQ particles are desirably spherical. The article is formed by heating the composition and shaping the heated composition, wherein the article and the filler and PSQ particles are dispersed therein, wherein the PSQ particles desirably maintain their spherical morphology.