A method includes forming an antimicrobial blend including an antimicrobial additive combined with a polymer, and forming a medical device with the antimicrobial blend, wherein a surface of the medical device exhibits antimicrobial properties.

A method includes forming an antimicrobial blend including an antimicrobial additive combined with a polymer, and forming a medical device with the antimicrobial blend, wherein a surface of the medical device exhibits antimicrobial properties.

Optical elements and compositions are provided which include an extruded polymer, and a plurality of fluorophores disposed within. The fluorescent compositions have quantum yields greater than 50% and are stable in performance over long durations of time under oxygen, moisture, and light exposure. In some embodiments, the extruded polymer is prepared as pellets, microparticles, nanoparticles, or films.

Optical elements and compositions are provided which include an extruded polymer, and a plurality of fluorophores disposed within. The fluorescent compositions have quantum yields greater than 50% and are stable in performance over long durations of time under oxygen, moisture, and light exposure. In some embodiments, the extruded polymer is prepared as pellets, microparticles, nanoparticles, or films.

A thermally conductive filler capable of exhibiting high thermal conductive properties with its specific gravity being reduced, a thermally conductive composite material and a wire harness that contains such a thermally conductive filler, and a method for forming a thermally conductive filler that can be used to form such a thermally conductive filler. A thermally conductive filler includes a hollow particle having a polar group on its surface, and a thermally conductive layer containing an inorganic compound that covers the surface of the hollow particle. Also, a thermally conductive composite material contains the thermally conductive filler and a matrix material, the thermally conductive filler being dispersed in the matrix material. Furthermore, a wire harness contains the thermally conductive composite material.

A thermally conductive filler capable of exhibiting high thermal conductive properties with its specific gravity being reduced, a thermally conductive composite material and a wire harness that contains such a thermally conductive filler, and a method for forming a thermally conductive filler that can be used to form such a thermally conductive filler. A thermally conductive filler includes a hollow particle having a polar group on its surface, and a thermally conductive layer containing an inorganic compound that covers the surface of the hollow particle. Also, a thermally conductive composite material contains the thermally conductive filler and a matrix material, the thermally conductive filler being dispersed in the matrix material. Furthermore, a wire harness contains the thermally conductive composite material.

A dispersion body having excellent heat ray shielding properties and long-term high temperature stability, and a dispersion liquid for producing the dispersion body, wherein the dispersion liquid contains liquid medium, absorbing fine particles dispersed in the medium, and a phosphite ester compound, the absorbing fine particles are one or more kinds of oxide fine particles selected from tungsten oxide fine particles represented by a general formula WyOz, and the phosphite ester compound is a phosphite ester compound represented by the following predetermined structural formula, and an addition amount of the phosphite ester compound is more than 500 parts by mass and 50000 parts by mass or less with respect to 100 parts by mass of the absorbing fine particles.

A dispersion body having excellent heat ray shielding properties and long-term high temperature stability, and a dispersion liquid for producing the dispersion body, wherein the dispersion liquid contains liquid medium, absorbing fine particles dispersed in the medium, and a phosphite ester compound, the absorbing fine particles are one or more kinds of oxide fine particles selected from tungsten oxide fine particles represented by a general formula WyOz, and the phosphite ester compound is a phosphite ester compound represented by the following predetermined structural formula, and an addition amount of the phosphite ester compound is more than 500 parts by mass and 50000 parts by mass or less with respect to 100 parts by mass of the absorbing fine particles.

The invention relates to a method of additive manufacturing an object using a 3D printing apparatus, in which at least one layer or part of at least one layer is formed by an addition-crosslinking electro-conductive silicone composition comprising : (A) at least one organopolysiloxane compound A comprising, per molecule at least two C.sub.2- C.sub.6 alkenyl radicals bonded to silicon atoms, (B) at least one organohydrogenopolysiloxane compound B comprising, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom, (C) at least one catalyst C comprising at least one metal from the platinum group or the compound thereof, (D) at least one reinforcing silica filler D, (E) at least one thixotropic agent which is selected from compounds having epoxy group, (poly)ether group, and/or (poly)ester group, organopolysiloxane having an aryl group and mixtures thereof; (F) at least one electro-conductive filler F, which is selected from nickel coated carbon, preferably graphite, graphene or mixtures thereof; (G) optionally at least one crosslinking inhibitor G.

The invention relates to a method of additive manufacturing an object using a 3D printing apparatus, in which at least one layer or part of at least one layer is formed by an addition-crosslinking electro-conductive silicone composition comprising : (A) at least one organopolysiloxane compound A comprising, per molecule at least two C.sub.2- C.sub.6 alkenyl radicals bonded to silicon atoms, (B) at least one organohydrogenopolysiloxane compound B comprising, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom, (C) at least one catalyst C comprising at least one metal from the platinum group or the compound thereof, (D) at least one reinforcing silica filler D, (E) at least one thixotropic agent which is selected from compounds having epoxy group, (poly)ether group, and/or (poly)ester group, organopolysiloxane having an aryl group and mixtures thereof; (F) at least one electro-conductive filler F, which is selected from nickel coated carbon, preferably graphite, graphene or mixtures thereof; (G) optionally at least one crosslinking inhibitor G.