Described herein is a latex blend comprising (i) an amorphous perfluoropolymer and (ii) an aqueous dispersion of semi crystalline fluoropolymer particles, wherein the particles comprise a TFE homopolymer or a TFE copolymer comprising no more than 1 wt % of a second fluorinated monomer, wherein the semi crystalline fluoropolymer particles (a) have an MFI (372° C. with 2.16 kg) of less than 50 g/10 min or (b) are not melt processible and have an SSG of less than 2.190, wherein the semi crystalline fluoropolymer particles have an average diameter greater than 100 nm.

Described herein is a latex blend comprising (i) an amorphous perfluoropolymer and (ii) an aqueous dispersion of semi crystalline fluoropolymer particles, wherein the particles comprise a TFE homopolymer or a TFE copolymer comprising no more than 1 wt % of a second fluorinated monomer, wherein the semi crystalline fluoropolymer particles (a) have an MFI (372° C. with 2.16 kg) of less than 50 g/10 min or (b) are not melt processible and have an SSG of less than 2.190, wherein the semi crystalline fluoropolymer particles have an average diameter greater than 100 nm.

The present invention provides a means for improving the elastic modulus (rigidity), heat resistance, toughness, and impact resistance of a resin to provide these properties in a good balance. The present invention provides a polymer microparticle-dispersed resin composition containing 100 parts by weight of a resin and 0.1 to 150 parts by weight of polymer microparticles each containing at least two layers: a crosslinked polymer layer and a coating polymer layer, the resin composition having a particle dispersity of the polymer microparticles in the resin of not lower than 50%, the crosslinked polymer layer including 50% by weight to 99% by weight of at least one monomer having a Tg, as determined as a homopolymer, of not lower than 0° C., and 50% by weight to 1% by weight of at least one monomer having a Tg, as determined as a homopolymer, of lower than 0° C.

The present invention provides a means for improving the elastic modulus (rigidity), heat resistance, toughness, and impact resistance of a resin to provide these properties in a good balance. The present invention provides a polymer microparticle-dispersed resin composition containing 100 parts by weight of a resin and 0.1 to 150 parts by weight of polymer microparticles each containing at least two layers: a crosslinked polymer layer and a coating polymer layer, the resin composition having a particle dispersity of the polymer microparticles in the resin of not lower than 50%, the crosslinked polymer layer including 50% by weight to 99% by weight of at least one monomer having a Tg, as determined as a homopolymer, of not lower than 0° C., and 50% by weight to 1% by weight of at least one monomer having a Tg, as determined as a homopolymer, of lower than 0° C.

Disclosed is a dipping composite material for enhancing the cut resistance of chemical-resistant gloves, wherein an additive is added to a latex, and the additive is a metal oxide and/or silica and/or glass fiber and/or basalt fiber and/or aramid fiber. The present invention improves the formula of a dipping layer such that the dipping layer has the cut resistance, which can significantly improve the cut resistant level of gloves.

Disclosed is a dipping composite material for enhancing the cut resistance of chemical-resistant gloves, wherein an additive is added to a latex, and the additive is a metal oxide and/or silica and/or glass fiber and/or basalt fiber and/or aramid fiber. The present invention improves the formula of a dipping layer such that the dipping layer has the cut resistance, which can significantly improve the cut resistant level of gloves.

Binder compositions that are formaldehyde free and include a latex emulsion, an epoxysilane, an epoxy dispersion, a polyol or a latex emulsion, a styrenic copolymer having carboxylic acid functionality, an epoxysilane or an epoxy dispersion or a mixture of both, a polyol and, optionally, an additive, wherein the composition does not comprise formaldehyde are described.

Binder compositions that are formaldehyde free and include a latex emulsion, an epoxysilane, an epoxy dispersion, a polyol or a latex emulsion, a styrenic copolymer having carboxylic acid functionality, an epoxysilane or an epoxy dispersion or a mixture of both, a polyol and, optionally, an additive, wherein the composition does not comprise formaldehyde are described.

Binder compositions that are formaldehyde free and include a latex emulsion, an epoxysilane, an epoxy dispersion, a polyol or a latex emulsion, a styrenic copolymer having carboxylic acid functionality, an epoxysilane or an epoxy dispersion or a mixture of both, a polyol and, optionally, an additive, wherein the composition does not comprise formaldehyde are described.

Binder compositions that are formaldehyde free and include a latex emulsion, an epoxysilane, an epoxy dispersion, a polyol or a latex emulsion, a styrenic copolymer having carboxylic acid functionality, an epoxysilane or an epoxy dispersion or a mixture of both, a polyol and, optionally, an additive, wherein the composition does not comprise formaldehyde are described.