Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

The present invention relates to a binder composition for a non-aqueous electrolyte battery, which is characterized by containing (A) polyvinyl alcohol, (B) at least one selected from a copolymer of vinyl alcohol and ethylenically unsaturated carboxylic acid and a neutralized salt of the copolymer and (C) at least one selected from an amino acid, a carboxylic acid-containing polymer and a polyamine; and a binder aqueous solution for a non-aqueous electrolyte battery, a slurry composition for a non-aqueous electrolyte battery, an electrode for a non-aqueous electrolyte battery, and a non-aqueous electrolyte battery, each containing the binder composition; and others.

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.

A rubber resin material with high thermal conductivity and a metal substrate with high thermal conductivity are provided. The rubber resin material includes inorganic fillers and a rubber resin composition with high thermal conductivity. The rubber resin composition with high thermal conductivity includes 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

The present disclosure relates to a polyamide molding composition including a semi-aromatic, semi-crystalline copolyamide and flat glass fibers that shows a low tendency to absorb moisture and thus maintains its excellent mechanical and optical properties also during storage and/or use.

The invention relates to a method for stabilizing halogen-free thermoplastic recyclates or pre-damaged plastics against oxidative, thermal, and/or actinic degradation. In the method according to the invention, at least one alditol or cyclitol is introduced into a halogen-free thermoplastic recyclate as a component, and optionally in addition thereto, at least one primary antioxidant and/or at least one secondary antioxidant is introduced into a halogen-free thermoplastic recyclate. By virtue of the method according to the invention, plastic recyclates can be stabilized against oxidative, thermal, and/or actinic degradation with a high degree of effectiveness and in a very environmentally friendly and inexpensive manner. The invention additionally relates to corresponding recyclate-based plastic compositions, to molding compound and molded parts produced therefrom, to stabilizer compositions, and to the use thereof for stabilizing halogen-free thermoplastic recyclates against oxidative, thermal, and/or actinic degradation.

The disclosed technology relates to a plastic compound suitable for preparing articles, such as pipe, with good physical properties, such as impact strength, and resistance to environmental stress cracking (ESC). In particular, the technology relates to a vinyl chloride resin, which includes chlorinated polyvinyl chloride (“CPVC”) homopolymer. Further-more, the invention relates to vinyl chloride homopolymer compounds containing the vinyl chloride homopolymer resin, and articles made from such compounds, which compounds meet 23447 cell classifications under ASTM D1784.

Compounds having hindered amine and oxyalkyl amine light stabilizers can mitigate the adverse effects of actinic radiation, such as visible and ultraviolet light, on polymers and copolymers. Polymers and copolymers derived from such compounds. Articles, such as coated articles and molded articles, containing such polymers or compounds.

The present invention relates to a composition for a gel cushion and to a gel cushion manufactured therefrom, the composition for a gel cushion comprising 5-8 parts by weight of an additive based on 100 parts by weight of a mixture of an oil and a copolymer which is obtained by polymerization of a polystyrene-based polymer and polypropylene.

Compounded copolyamide powders, processes for preparation of compounded copolyamide powders, articles made therefrom and uses.