Provided are fluorine-free, oleophobic layers including one more or polydimethylsiloxane resin layers. The layers can be disposed on a portion of or all of a surface of a substrate. Also provided are methods of making and using same.

Provided are fluorine-free, oleophobic layers including one more or polydimethylsiloxane resin layers. The layers can be disposed on a portion of or all of a surface of a substrate. Also provided are methods of making and using same.

Quantities of plastic solids derived from mixed plastic waste are provided. The quantities can comprise polyolefins and/or polyethylene terephthalate and can be co-located with other quantities of plastic solids. The quantities of solids plastics can comprise particulate plastic solids that are suitable for use as feedstocks to various chemical recycling processes.

Disclosed herein are graft polymers having a copolymer backbone and polycyclic aromatic hydrocarbon branches for use as a nanofiller dispersant and methods for making the same. Also disclosed are elastomeric nanocomposite compositions comprising a halobutyl rubber matrix, nanoparticles of graphite or grapheme, and the graft polymer. Such elastomeric nanocomposite compositions are suitable as tire innerliners or innertubes.

Provided is a halogen-free resin composition including a polyolefin resin, containing a phosphorus compound in an amount of 0.05 to 2.5 mass % as a phosphorus content; a NOR-type hindered amine in an amount of 0.05 to 5 mass %; and an inorganic filler in an amount of 3 to 50 mass %, respectively, with respect to the total amount of the resin composition, wherein a DTA (Differential Thermal Analysis) curve obtained by differential thermal analysis of the inorganic filler has an endothermic portion in a temperature range of 180 to 500° C.; and in the inorganic filler, a ratio value of a number of particles having a maximum diameter of 300 μm or more to a number of particles having a maximum diameter of 100 μm or more is ⅕ or less, or there are no particles having a maximum diameter of 100 μm or more.

The present invention relates to a flame retardant resin composition having excellent flame retardancy and improved thermal deformation properties, and a flame retardant resin molded article manufactured therefrom, and provides a flame retardant resin composition including a) a base resin including a polyarylene ether-based polymer; an aromatic vinyl-based polymer and a copolymer of vinylcyan monomer-conjugated diene monomer-aromatic vinyl monomer; b) an organophosphorus-based flame retardant; c) a hypophosphite compound; and d) a sulfur-containing compound including at least two sulfur atoms, wherein b) the organophosphorus-based flame retardant, c) the hypophosphite compound and d) the sulfur-containing compound are included in a weight ratio of 15 to 24:2 to 4:2 to 5.

Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.