The present disclosure discloses a low-water-vapor-permeability polyolefin-elastomer film and its preparation method. The film comprises: 50-100 mass parts of a matrix resin, 0-40 mass parts of a modified resin, 0.001-2 mass parts of an activator, 0.1-3 mass parts of an organic peroxide, 0.02-5 mass parts of an assistant cross-linker, 0.02-2 mass parts of a silane coupling agent, 0.005-2 mass parts of a light stabilizer, and 0-20 mass parts of a water blocking filler. In the present disclosure, by adding the modified resin and the activator that have an active group, a cross-linking degree and a cross-linking density of the film are improved, and a water-vapor permeability is reduced; by adding the water blocking filler, the water blocking property of the film is further improved, thereby ensuring reliability of the assembly, and prolonging service life of the assembly.

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.

A composition crosslinkable by condensation reaction and producible using (A) organopolysiloxanes of the formula (R.sup.2O).sub.3-aSiR.sup.1.sub.aO(SiR.sub.2O).sub.nSiR.sup.1.sub.a(OR.sup.2).sub.3-a (I), (B1) silanes of the formula R.sup.3.sub.4-b(R.sup.4O).sub.bSi (II), and optionally (B2) silicon compounds consisting of units of the formula R.sup.7.sub.c(R.sup.8O).sub.dSiO.sub.(4-c-d)/2 (III). The composition contains organosilicon compounds having a molecular weight of less than or equal to 195 g/mol maximally in amounts of less than 0.5 wt%, based on organopolysiloxane (A).

An (electron beam)-curable (EBC) formulation comprising an EBC polyolefin compound having a crystallinity of from 0 to less than 50 weight percent (wt %) and/or having a density of 0.930 gram per cubic centimeter (g/cm.sup.3) or less; and an alkenyl-functional monocyclic organosiloxane (“silicon-based coagent”). Also included are a cured polyolefin product prepared by electron-beam irradiating the EBC formulation; methods of making and using the EBC formulation or cured polyolefin product; and articles containing or made from the EBC formulation or cured polyolefin product.

A curable polyorganosiloxane composition includes (a) a polyorganosiloxane having two or more curable functional groups per molecule; (b) a crosslinking agent having per molecule two or more crosslinkable groups having reactivity with the curable functional groups of the component (a); (c) a curing catalyst capable of catalyzing a crosslinking reaction of the component (a) and the component (b); (d) a pigment which itself does not emit a fluorescent light; and (e) a UV tracer. The composition can be used as an adhesive.

The present invention relates to a method for the preparation of a synthetic rubber blend, wherein the blend comprises a high molecular weight polydiene (A) and a low molecular weight polydiene (B). The present invention further relates to a synthetic rubber blend obtainable according to the method described herein; as well as to rubber compositions comprising the blend; and articles, such as tires.

Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.

The invention relates to a copolymer of ethylene and of a 1,3-diene of formula CH.sub.2═CR—CH═CH.sub.2, which copolymer bears a silanol or alkoxysilane function, the symbol R representing a hydrocarbon chain having from 3 to 20 carbon atoms. Such a copolymer improves the compromise between the content of ethylene in the polymer, its crystallinity and the stiffness of a rubber composition containing it.

A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1):

##STR00001##

In Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.

Method of manufacturing a photovoltaic module comprising at least a first layer and a second layer affixed to each other by means of an encapsulant, said method comprising a lamination step wherein the encapsulant material comprises a silane-modified polyolefin having a melting point below 90° C., pigment particles and an additive comprising a cross-linking catalyst; and wherein in said lamination step heat and pressure are applied to the module, said heat being applied at a temperature between 60° C. and 125° C.