The invention relates to a crosslinkable polymer composition comprising (a) a polyolefin bearing hydrolysable silane groups and a silanol condensation catalyst compound, as well as to an article, preferably a cable, thereof. Also the use of the silanol condensation catalyst compound for crosslinking an article, preferably a layer of a cable is provided.

A conductive resin composition has low-temperature curability and is excellent in resistance stability during stretching. A conductive resin composition contains: (A) a polyorganosiloxane having an alkenyl group, (B) a polyorganosiloxane having a specific structure, (C) a conductive particle, (D) a compound having a hydrosilyl group, and (E) a hydrosilylation catalyst.
The content of the component (B) is 6 to 50 parts by mass based on 100 parts by mass of the component (A).

Compositions are disclosed which include between about 0.05 to about 5 or less wt. % of at least one acrylate monomer based on the total weight of the composition. The acrylate monomer reduces the peak cure temperature, thereby accelerating the rate of cure, without sacrificing completeness of the cure or the release performance of the cured product. The addition of the acrylate monomer also enables a reduction in the amount of costly platinum catalyst required to effectively cure a composition. In addition to the acrylate monomer, the compositions also include a silicone base polymer, a crosslinking agent, and platinum catalyst. The cured compositions exhibit properties useful for incorporation into release liners, adhesive articles, medical products and gaskets.

The present disclosure generally relates to catalyst systems, polyethylene compositions, and uses of such compositions in, e.g., films. In an embodiment is provided a film that includes a polyethylene composition, comprising: ethylene and a C.sub.3-C.sub.40 olefin comonomer, the polyethylene composition having at least 75 wt % ethylene content and from 0 wt % to 25 wt % of a C.sub.3-C.sub.40 olefin comonomer content based upon the total weight of the composition as determined by GPC-IR5-LS-VIS, the film having: an average of MD and TD 1% secant modulus of 42,000 psi or greater as determined by ASTM D-882, and a Dart Drop Impact of greater than 400 g/mil, as determined by ASTM D1709. In another embodiment is provided a process for producing a polyethylene composition, comprising: introducing, under first polymerization conditions, ethylene and a C.sub.3-C.sub.40 alpha-olefin to a catalyst system in a reactor, the catalyst system comprising a first catalyst compound, a second catalyst compound, and an activator; and forming a polyethylene composition.

The present disclosure generally relates to catalyst systems, polyethylene compositions, and uses of such compositions in, e.g., films. In an embodiment is provided a film that includes a polyethylene composition, comprising: ethylene and a C.sub.3-C.sub.40 olefin comonomer, the polyethylene composition having at least 65 wt % ethylene content and from 0 wt % to 35 wt % of a C.sub.3-C.sub.40 olefin comonomer content based upon the total weight of the composition, the film having: an average of MD and TD 1% secant modulus of 43,000 psi or greater, and a Dart Drop Impact Strength of greater than 500 g/mil. In another embodiment is provided a process for producing a polyethylene composition that includes introducing ethylene and a C.sub.3-C.sub.40 alpha-olefin to a catalyst system, the catalyst system comprising a first catalyst compound, a second catalyst compound, and an activator; and forming a polyethylene composition.

A high thermal conductive silicone composition including: (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups in one molecule and a kinematic viscosity at 25 C of 100 to 100,000 mm.sup.2/s; (B) an aluminum powder having an average particle size of 50 μm or more; (C) a thermal conductive filler having an average particle size of 0.1 to less than 50 μm; (D) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to a silicon atom (Si—H groups) in one molecule; (E) a hydrolyzable organopolysiloxane represented by the following general formula (1); and (F) a platinum group metal catalyst having an effective amount. The high thermal conductive silicone composition can conform to the warpage of a substrate due to an increased material thickness and can maintain heat dissipation performance due to a high thermal conductivity.

##STR00001##

A two steps polymerization process for obtaining a polyolefin composition comprising: a) from 25 wt % to 70 wt % of a propylene homopolymer or a propylene-ethylene copolymer containing from 0.1 wt % to 10 wt % of ethylene derived units; b) from 27 wt % to 70 wt % of a copolymer of ethylene and at least one C.sub.3-C.sub.20 alpha olefins, wherein the ethylene derived units content ranges from 15 wt % to 70 wt %; c) from 3 wt % to 20 wt % of polyethylene homopolymer or an ethylene and at least one C.sub.3-C.sub.20 alpha olefins copolymer; the sum a)+b)+c) being 100, wherein said process comprises: step a) contacting under polymerization conditions propylene, optionally ethylene and the catalyst system in order to obtain component a), step b) contacting under polymerization conditions ethylene and at least one C3-C20 alpha-olefins and the catalyst system in order to obtain components b) and c); wherein the catalyst system comprises a metallocene compound and an iron complex.

A thermally conductive silicone gel composition of the present invention includes the following A to F: (A) an organopolysiloxane having two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having two Si—H groups per molecule; (C) an organohydrogenpolysiloxane having three or more Si—H groups per molecule; (D) at least one compound selected from the group consisting of D1 and D2: (D1) an organopolysiloxane having one alkenyl group per molecule and (D2) an organohydrogenpolysiloxane having one Si—H group per molecule; (E) a platinum catalyst; and (F) a thermally conductive filler in an amount of 100 to 600 vol % with respect to 100 vol % of the total amount of the A to E. The components A to F are cured. With this configuration, the thermally conductive silicone gel composition can reduce oil bleeding, even though the composition is a gel cured product.

A polybutadiene composition which enables the achievement of a rubber material that has excellent crack propagation resistance and a method for producing this polybutadiene composition are provided. A polybutadiene composition is produced by a method that comprises a step Y wherein 1,3-butadiene is polymerized in the presence of 1,2-polybutadiene and a lanthanoid catalyst. A polybutadiene composition which contains 1,2-polybutadiene and 1,4-polybutadiene, and which is obtained by polymerizing 1,3-butadiene in the presence of 1,2-polybutadiene and a lanthanoid catalyst.

Compositions are disclosed which include between about 0.05 to about 5 or less wt. % of at least one acrylate monomer based on the total weight of the composition. The acrylate monomer reduces the peak cure temperature, thereby accelerating the rate of cure, without sacrificing completeness of the cure or the release performance of the cured product. The addition of the acrylate monomer also enables a reduction in the amount of costly platinum catalyst required to effectively cure a composition. In addition to the acrylate monomer, the compositions also include a silicone base polymer, a crosslinking agent, and platinum catalyst. The cured compositions exhibit properties useful for incorporation into release liners, adhesive articles, medical products and gaskets.