The present invention relates to an adsorbent resin for removing perfluorinated pollutants from a body of water, a preparation therefor and the use thereof. The objective is to solve the problem of traditional adsorbent materials, such as active carbon materials, having a poor effect in terms of removing perfluorooctanoic acid from water, being non-renewable, etc. In the present method, styrene and divinylbenzene are used as framework materials, a suitable pore-forming agent and a suitable dispersant are selected in order to prepare a macroporous resin with a moderate pore size, and an alkylation reaction is carried out at a low hindrance with p-xylylene dichloride (XDC) being used as a post-crosslinking agent, whereby a rigid benzene ring structure is introduced into the resin by means of post-crosslinking, thereby further increasing the hydrophobicity of the resin and increasing the crosslinking degree thereof; in addition, the micropore structure is adjusted in order to obtain an adsorbent resin with a narrow particle size distribution, a uniform pore size and a high specific surface area. The size of micropores in the resin is close to the molecular size of perfluorooctanoates in water, the adsorbate sieving capacity is strong, and the adsorption rate of perfluorinated compounds can be further improved.

Objects of the present invention are to provide an organic semiconductor element in which carrier mobility is high, variation of mobility is suppressed, and temporal stability under high temperature and high humidity is excellent, and a manufacturing method thereof, to provide a novel compound suitable for an organic semiconductor, and to provide an organic semiconductor film in which mobility is high, variation of mobility is suppressed, and temporal stability under high temperature and high humidity is excellent, a manufacturing method thereof, and an organic semiconductor composition that can suitably form the organic semiconductor film.

The organic semiconductor element according to the present invention is an organic semiconductor layer containing a compound having a constitutional repeating unit represented by Formula 1 and having a molecular weight of 2,000 or greater.

D-A  (1)

Objects of the present invention are to provide an organic semiconductor element in which carrier mobility is high, variation of mobility is suppressed, and temporal stability under high temperature and high humidity is excellent, and a manufacturing method thereof, to provide a novel compound suitable for an organic semiconductor, and to provide an organic semiconductor film in which mobility is high, variation of mobility is suppressed, and temporal stability under high temperature and high humidity is excellent, a manufacturing method thereof, and an organic semiconductor composition that can suitably form the organic semiconductor film.

The organic semiconductor element according to the present invention is an organic semiconductor layer containing a compound having a constitutional repeating unit represented by Formula 1 and having a molecular weight of 2,000 or greater.

D-A  (1)

A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.

The present invention relates to vulcanisates comprising hydrogenated nitrile rubber (HNBR) and at least one polycyclic aromatic hydrocarbon (PAH), and to the use thereof as belts, gaskets or hoses.

The present invention relates to vulcanisates comprising hydrogenated nitrile rubber (HNBR) and at least one polycyclic aromatic hydrocarbon (PAH), and to the use thereof as belts, gaskets or hoses.

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

##STR00001##

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

##STR00001##

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.