The present disclosure relates to a coating composition, comprising a fluoropolymer component in the form of a fluoropolymer micropowder having a weight average molecular weight of from 300,000 g/mol to 400,000 g/mol, a binder resin, a hydroxy-functional silicone resin; and a silicone oil, as well as articles coated with the composition.

The present disclosure relates to a coating composition, comprising a fluoropolymer component in the form of a fluoropolymer micropowder having a weight average molecular weight of from 300,000 g/mol to 400,000 g/mol, a binder resin, a hydroxy-functional silicone resin; and a silicone oil, as well as articles coated with the composition.

Embossing resins, methods of manufacturing such resins, and electrokinetic display system, which includes display cells containing such resins. The resins include a fluoropolymer in weight percentage 5%-60%, a difunctional diluent in weight percentage 0-30%, a monofunctional diluent in weight percentage 0-40%, a urethane diacrylate or functionalized nanoscale material, e.g., a functionalized urethane material, in weight percentage 5-50%, a photoinitiator in weight percentage 0.5-5%, and a surfactant in weight percentage less than 0.5%. The difunctional diluent may be Hexanediol Diacrylate, and the monofunctional diluent may be a monofunctional hydrocarbon. The resins are made by identifying a target index of refraction for a cured state thereof, and combining together, by weight percentage, the constituent components to produce the liquid state version of the embossing resin having a desired composite index of refraction.

Embossing resins, methods of manufacturing such resins, and electrokinetic display system, which includes display cells containing such resins. The resins include a fluoropolymer in weight percentage 5%-60%, a difunctional diluent in weight percentage 0-30%, a monofunctional diluent in weight percentage 0-40%, a urethane diacrylate or functionalized nanoscale material, e.g., a functionalized urethane material, in weight percentage 5-50%, a photoinitiator in weight percentage 0.5-5%, and a surfactant in weight percentage less than 0.5%. The difunctional diluent may be Hexanediol Diacrylate, and the monofunctional diluent may be a monofunctional hydrocarbon. The resins are made by identifying a target index of refraction for a cured state thereof, and combining together, by weight percentage, the constituent components to produce the liquid state version of the embossing resin having a desired composite index of refraction.

A water based paint that can be used to form a superhydrophobic coating includes a fluorinated particulate filler, a water soluble or water suspendable resin, and an aqueous solvent. The superhydrophobic paint can be applied to a surface where the loss of the solvent results in a superhydrophobic coating.

A water based paint that can be used to form a superhydrophobic coating includes a fluorinated particulate filler, a water soluble or water suspendable resin, and an aqueous solvent. The superhydrophobic paint can be applied to a surface where the loss of the solvent results in a superhydrophobic coating.

The invention provides a method for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates. The method includes attaching a polymer-polymer composite polishing pad having a polishing layer to a polishing device. A hydrophilic polymeric matrix forms the polishing layer. Cationic fluoropolymer particles having nitrogen-containing end groups are embedded in the polymeric matrix. A slurry containing anionic particles is applied to the polymer-polymer composite polishing pad and rubbed against the substrate to polish or planarize the substrate with the fluoropolymer particles interacting with the anionic particles to increase polishing removal rate.

The invention provides a method for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates. The method includes attaching a polymer-polymer composite polishing pad having a polishing layer to a polishing device. A hydrophilic polymeric matrix forms the polishing layer. Cationic fluoropolymer particles having nitrogen-containing end groups are embedded in the polymeric matrix. A slurry containing anionic particles is applied to the polymer-polymer composite polishing pad and rubbed against the substrate to polish or planarize the substrate with the fluoropolymer particles interacting with the anionic particles to increase polishing removal rate.

A dielectric, including a halogenated olefin having from 2 to 4 carbon atoms, and having a water content of 6000 ppm or less in terms of mass.

A dielectric, including a halogenated olefin having from 2 to 4 carbon atoms, and having a water content of 6000 ppm or less in terms of mass.