A light-cured anti-slip structure includes an anti-slip layer fixed onto a substrate surface. The anti-slip layer is composed of the light-curing composite, wherein the light-curing composite includes 50 wt % to 100 wt % of photopolymer, 0.5 wt % to 20 wt % of photoinitiator, 5 wt % to 50 wt % of thermosetting polymer, less than or equal to 5 wt % of thermal curing initiator, which are mixed. The photoinitiator receives light energy to trigger a light-curing reaction of the photopolymer. Simultaneously the photoinitiator releases heat to activate the thermal curing initiator, the thermal curing initiator induces a curing reaction of the thermosetting polymer to form the anti-slip layer. The light-cured anti-slip structure provided by the present invention could be quickly cured on the substrate surface, and the manufacturing time and the cost of material could be significantly reduced. A manufacturing method of a light-cured anti-slip structure is provided as well.

A light-cured anti-slip structure includes an anti-slip layer fixed onto a substrate surface. The anti-slip layer is composed of the light-curing composite, wherein the light-curing composite includes 50 wt % to 100 wt % of photopolymer, 0.5 wt % to 20 wt % of photoinitiator, 5 wt % to 50 wt % of thermosetting polymer, less than or equal to 5 wt % of thermal curing initiator, which are mixed. The photoinitiator receives light energy to trigger a light-curing reaction of the photopolymer. Simultaneously the photoinitiator releases heat to activate the thermal curing initiator, the thermal curing initiator induces a curing reaction of the thermosetting polymer to form the anti-slip layer. The light-cured anti-slip structure provided by the present invention could be quickly cured on the substrate surface, and the manufacturing time and the cost of material could be significantly reduced. A manufacturing method of a light-cured anti-slip structure is provided as well.

A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.

A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.

Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.

Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.

Novel polyamide-metal laminates which have desirable hydrolysis resistance are provided. The laminates comprise (A) a metal, (B) a tie layer, and (C) a polyamide composition. The tie layer is formed from a composition containing (B1) a polymer containing a comonomer having at least two adjacent carboxylic acid groups and (B2) an amino-silane containing a primary amine and at least one hydroxyl group.

Novel polyamide-metal laminates which have desirable hydrolysis resistance are provided. The laminates comprise (A) a metal, (B) a tie layer, and (C) a polyamide composition. The tie layer is formed from a composition containing (B1) a polymer containing a comonomer having at least two adjacent carboxylic acid groups and (B2) an amino-silane containing a primary amine and at least one hydroxyl group.

A process for producing an article by three-dimensional printing includes applying a 1,1-di-activated vinyl compound-containing liquid binder over a predetermined area of a layer of solid particles. The liquid binder infiltrates gaps between the solid particles to form a first cross-sectional layer of an article, and the 1,1-di-activated vinyl compound reacts to solidify the liquid binder and bind the solid particles in the first cross-sectional layer of the article. Also provided is an article produced by the three-dimensional printing process, set forth herein.

A process for producing an article by three-dimensional printing includes applying a 1,1-di-activated vinyl compound-containing liquid binder over a predetermined area of a layer of solid particles. The liquid binder infiltrates gaps between the solid particles to form a first cross-sectional layer of an article, and the 1,1-di-activated vinyl compound reacts to solidify the liquid binder and bind the solid particles in the first cross-sectional layer of the article. Also provided is an article produced by the three-dimensional printing process, set forth herein.