A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

Use of a coating composition on a chromium free tinplate substrate, the coating composition comprising: a polyester material, and benzoguanamine or a derivative thereof, wherein the coating composition is substantially free of bisphenol A (BPA), bisphenol F (BPF), bisphenol A diglycidyl ether (BADGE) and bisphenol F diglycidyl ether (BFDGE).

Use of a coating composition on a chromium free tinplate substrate, the coating composition comprising: a polyester material, and benzoguanamine or a derivative thereof, wherein the coating composition is substantially free of bisphenol A (BPA), bisphenol F (BPF), bisphenol A diglycidyl ether (BADGE) and bisphenol F diglycidyl ether (BFDGE).

Use of a coating composition on a chromium free tinplate substrate, the coating composition comprising: a polyester material, and benzoguanamine or a derivative thereof, wherein the coating composition is substantially free of bisphenol A (BPA), bisphenol F (BPF), bisphenol A diglycidyl ether (BADGE) and bisphenol F diglycidyl ether (BFDGE).

The present invention relates to an adhesive composition comprising a polyvinyl alcohol and a water-soluble polyphenol compound, to an adhesive comprising the same, and to a manufacturing method therefor and, more specifically, to an adhesive composition, which has little toxicity, can adhere even without a curing process unlike a conventional adhesive, enables the manufacturing of a gel by hydrogen binding characteristics between the polyvinyl alcohol compound and the water-soluble polyphenol compound, and retains adhesive properties in water.

The present invention relates to an adhesive composition comprising a polyvinyl alcohol and a water-soluble polyphenol compound, to an adhesive comprising the same, and to a manufacturing method therefor and, more specifically, to an adhesive composition, which has little toxicity, can adhere even without a curing process unlike a conventional adhesive, enables the manufacturing of a gel by hydrogen binding characteristics between the polyvinyl alcohol compound and the water-soluble polyphenol compound, and retains adhesive properties in water.