C08L61/20

Anhydrous routes to highly processable covalent network polymers and blends

The present invention generally relates to covalent network polymers prepared from an imine-linked oligomer and an independent crosslinker comprising reactive moieties selected from the group consisting of epoxy, isocyanate, bismaleimide, sulfide, polyurethane, anhydride, polyester and combinations thereof. The covalent network polymers disclosed herein are advantageously made by anhydrous reactions, which enables the highest known glass transition temperatures to date for this class of materials. Further, the disclosed covalent network polymers can be formed in continuous processes, such as additive manufacturing processes that produce three-dimensional objects or roll-to-roll processes that produce covalent network polymer films or fully cured prepreg in various size formats.

Anhydrous routes to highly processable covalent network polymers and blends

The present invention generally relates to covalent network polymers prepared from an imine-linked oligomer and an independent crosslinker comprising reactive moieties selected from the group consisting of epoxy, isocyanate, bismaleimide, sulfide, polyurethane, anhydride, polyester and combinations thereof. The covalent network polymers disclosed herein are advantageously made by anhydrous reactions, which enables the highest known glass transition temperatures to date for this class of materials. Further, the disclosed covalent network polymers can be formed in continuous processes, such as additive manufacturing processes that produce three-dimensional objects or roll-to-roll processes that produce covalent network polymer films or fully cured prepreg in various size formats.

Formaldehyde-free binder compositions and methods of making the binders under controlled acidic conditions

Formaldehyde-free binder compositions are described that include an aldehyde or ketone, a reaction product between a polyamine and an organic anhydride, and an acidic compound. The acidic compound may be an organic acid, an acidic catalyst, or both. The acidic compound is supplied in quantities that lower the pH of the binder composition to about 5 or less. The binder compositions may be used in methods of binding fiberglass and the resulting fiberglass products have an improved tensile strength due to the addition of the acidic compound.

Formaldehyde-free binder compositions and methods of making the binders under controlled acidic conditions

Formaldehyde-free binder compositions are described that include an aldehyde or ketone, a reaction product between a polyamine and an organic anhydride, and an acidic compound. The acidic compound may be an organic acid, an acidic catalyst, or both. The acidic compound is supplied in quantities that lower the pH of the binder composition to about 5 or less. The binder compositions may be used in methods of binding fiberglass and the resulting fiberglass products have an improved tensile strength due to the addition of the acidic compound.

Formaldehyde-free binder compositions and methods of making the binders under controlled acidic conditions

Formaldehyde-free binder compositions are described that include an aldehyde or ketone, a reaction product between a polyamine and an organic anhydride, and an acidic compound. The acidic compound may be an organic acid, an acidic catalyst, or both. The acidic compound is supplied in quantities that lower the pH of the binder composition to about 5 or less. The binder compositions may be used in methods of binding fiberglass and the resulting fiberglass products have an improved tensile strength due to the addition of the acidic compound.

THERMOSET UNDERCOATING COMPOSITIONS COMPATIBLE WITH FREE-RADICALLY CURED OVERCOATING FOR METAL SUBSTRATES
20230193048 · 2023-06-22 · ·

A thermoset undercoating composition for a food or beverage container or other packaging container, the thermoset undercoating composition comprising a binder polymer, an adhesion promoting additive comprising an aminoplast resin having at least one reactive group having an ethylenically unsaturated double bond that is reactive under free-radical curing conditions, an optional crosslinker configured to react with the binder polymer upon thermal curing of the thermoset undercoating composition, wherein the optional crosslinker preferably does not include groups that are reactive under free-radical curing conditions, and a liquid carrier.

THERMOSET UNDERCOATING COMPOSITIONS COMPATIBLE WITH FREE-RADICALLY CURED OVERCOATING FOR METAL SUBSTRATES
20230193048 · 2023-06-22 · ·

A thermoset undercoating composition for a food or beverage container or other packaging container, the thermoset undercoating composition comprising a binder polymer, an adhesion promoting additive comprising an aminoplast resin having at least one reactive group having an ethylenically unsaturated double bond that is reactive under free-radical curing conditions, an optional crosslinker configured to react with the binder polymer upon thermal curing of the thermoset undercoating composition, wherein the optional crosslinker preferably does not include groups that are reactive under free-radical curing conditions, and a liquid carrier.

PRODUCT AND METHOD FOR A PLASTIC COMPOSITION COMPRISING INORGANIC MATERIALS
20170292004 · 2017-10-12 ·

Products and methods for producing products which comprise polyethylene and inorganic minerals for a single layer plastic composition.

PRODUCT AND METHOD FOR A PLASTIC COMPOSITION COMPRISING INORGANIC MATERIALS
20170292004 · 2017-10-12 ·

Products and methods for producing products which comprise polyethylene and inorganic minerals for a single layer plastic composition.

Modified novolak phenolic resin, making method, and resist composition

A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.