Patent classifications
C08L61/34
Composite materials containing benzoxazines and method for making the same
A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.
Composite materials containing benzoxazines and method for making the same
A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.
Composite materials containing benzoxazines and method for making the same
A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.
Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device
Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device
Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE
The present application provides a film containing: a compound (A) containing at least one selected from the group consisting of a maleimide compound and a citraconimide compound; an organic peroxide (B) containing at least one selected from the group consisting of organic peroxides represented by specific formulae; and an imidazole compound (C) represented by a specific formula.
Method for preparing nano attapulgite and phenolic aerogel and method for preparing abrasion-resistant vehicle tire
A method for preparing an aerogel comprising nano attapulgite and phenolic aldehyde and a method for preparing abrasion-resistant vehicle tire. 80-100 weight distributions of rubber, 3-8 weight distributions of SiO.sub.2.nH.sub.2O, 3-6 weight distributions of an anti-aging agent, 3-4 weight distributions of a heat stabilizer, 3-5 weight distributions of a compatibilizing agent, and 3-12 weight distributions of the aerogel comprising the nano attapulgite and the phenolic aldehyde is selected as a raw material of the abrasion-resistant rubber material to prepare rubber composite material for the abrasion-resistant vehicle tire.
Method for preparing nano attapulgite and phenolic aerogel and method for preparing abrasion-resistant vehicle tire
A method for preparing an aerogel comprising nano attapulgite and phenolic aldehyde and a method for preparing abrasion-resistant vehicle tire. 80-100 weight distributions of rubber, 3-8 weight distributions of SiO.sub.2.nH.sub.2O, 3-6 weight distributions of an anti-aging agent, 3-4 weight distributions of a heat stabilizer, 3-5 weight distributions of a compatibilizing agent, and 3-12 weight distributions of the aerogel comprising the nano attapulgite and the phenolic aldehyde is selected as a raw material of the abrasion-resistant rubber material to prepare rubber composite material for the abrasion-resistant vehicle tire.
Methods for sol-gel polymerization in absence of solvent and creation of tunable carbon structure from same
The present application is directed to methods for solvent-free preparation of polymers and their subsequent processing into activated carbon materials. These methods unexpectedly demonstrate ability to tune pore structure in the polymer gel and carbon produced there from, while also providing distinct advantages over the current art.
Methods for sol-gel polymerization in absence of solvent and creation of tunable carbon structure from same
The present application is directed to methods for solvent-free preparation of polymers and their subsequent processing into activated carbon materials. These methods unexpectedly demonstrate ability to tune pore structure in the polymer gel and carbon produced there from, while also providing distinct advantages over the current art.