The invention relates to a method for producing hydrophilic silicia moulded bodies, in which i) a mixture containing hydrophilic silicic acid is added at a maximum temperature of 55° C. to hydrophobic means and ii) the mixture obtained in step i) is compacted after a maximum storage time of 30 days to form moulded bodies, iii) during steps ii and iii and until the moulded bodies are used, the temperature is at a maximum of 55° C.

A method for producing a silica composite particle including a silica particle and at least one compound in which an aluminum atom bonds to an organic group through oxygen. The method includes: (i) providing a silica particle dispersion liquid having a silica particle content of about 20 mass % or more; (ii) mixing and reacting a compound represented by formula (S1) and the silica particle dispersion liquid to obtain a slurry; (iii) providing the at least one compound; and (iv) then mixing and reacting the slurry with the at least one compound to form the silica composite particle.

An organic substance-attached porous inorganic oxide particle including porous inorganic oxide particle and an organic substance attached to the surface of the porous inorganic oxide particle. The organic substance-attached porous inorganic oxide particle satisfies a formula below
(Cf−Ce)/2>1
where Cf represents the amount of carbon (atom %) measured by subjecting the surface of the particle to X-ray photoelectron spectroscopy (XPS) after the particle is washed, and Ce represents the amount of carbon (atom %) measured by subjecting the surface of the particle to X-ray photoelectron spectroscopy (XPS) after two-minute surface etching of the particle.

The present invention relates to hollow silica particles, which each includes a shell layer containing silica and a space inside the shell layer, in which the hollow silica particles have a peak intensity derived from SiOH at a wavenumber of around 3,746 cm.sup.−1 of 0.60 or less by infrared spectroscopy, a relative permittivity at 1 GHz of from 1.3 to 5.0 and a dielectric loss tangent at 1 GHz of from 0.0001 to 0.05.

The present invention relates to hollow silica particles, which each includes a shell layer containing silica and a space inside the shell layer, in which the hollow silica particles have a peak intensity derived from SiOH at a wavenumber of around 3,746 cm.sup.−1 of 0.60 or less by infrared spectroscopy, a relative permittivity at 1 GHz of from 1.3 to 5.0 and a dielectric loss tangent at 1 GHz of from 0.0001 to 0.05.

The present disclosure relates to a combined treatment method for surface modification of fumed silica, which comprises the following steps: (1) two sets of modification devices are used to jointly treat fumed silica; the fumed silica is modified with a modifier in the reaction furnace of each set of modification devices to obtain two groups of modified fumed silica and exhaust gas respectively; (2) the exhaust gas obtained in step (1) is separated respectively to obtain unreacted modifier and by-products, and the obtained by-products are input into the reaction furnace of the other set of modification devices as reaction assistants to participate in the modification reaction; and the obtained unreacted modifiers are returned to the reaction furnace of the original modification device for repeated use.

Porous metal oxide microspheres are prepared via a process comprising forming a liquid dispersion of polymer nanoparticles and a metal oxide; forming liquid droplets of the dispersion; drying the droplets to provide polymer template microspheres comprising polymer nanospheres; and removing the polymer nanospheres from the template microspheres to provide the porous metal oxide microspheres. The porous microspheres exhibit saturated colors and are suitable as colorants for a variety of end-uses.

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

Methods of forming cement pastes, methods of forming concrete, and methods of forming other compositions using mineral particles formed from the one or more of biomineralizing microorganisms and biomineralizing microorganisms. Desired features, such as size and morphology, can be controlled by controlling growth parameters of the biomineralizing microorganisms and biomineralizing microorganisms.