The invention relates to copper-containing metal pigments, wherein the copper-containing metal pigments have an elemental copper content of at least 50 wt.-%, relative to the total weight of the uncoated copper-containing metal pigment, wherein the copper-containing metal pigments have at least one enveloping metal oxide layer and at least one enveloping chemically non-reactive plastic layer, wherein the sum of the amounts of the at least one chemically non-reactive plastic layer and of the at least one metal oxide layer lies in a range of from 10 to 50 wt.-%, relative to the weight of the uncoated metal pigment, and the weight ratio of the at least one metal oxide layer to the at least one chemically non-reactive plastic layer lies in a range of from 1:2 to 1:20. The invention furthermore relates to a method for producing these pigments and the use thereof.

The invention relates to copper-containing metal pigments, wherein the copper-containing metal pigments have an elemental copper content of at least 50 wt.-%, relative to the total weight of the uncoated copper-containing metal pigment, wherein the copper-containing metal pigments have at least one enveloping metal oxide layer and at least one enveloping chemically non-reactive plastic layer, wherein the sum of the amounts of the at least one chemically non-reactive plastic layer and of the at least one metal oxide layer lies in a range of from 10 to 50 wt.-%, relative to the weight of the uncoated metal pigment, and the weight ratio of the at least one metal oxide layer to the at least one chemically non-reactive plastic layer lies in a range of from 1:2 to 1:20. The invention furthermore relates to a method for producing these pigments and the use thereof.

There is provided conductive paste excellent in electro-conductivity and thermal conductivity. Conductive paste comprising conductive filler being composite particles including copper powder and nanosize precipitates which are disposed on the surface of the copper powder and composed of at least one kind of transition metal belonging to the group 8 to group 10 of the periodic table or a compound of the transition metal, and a binder resin.

There is provided conductive paste excellent in electro-conductivity and thermal conductivity. Conductive paste comprising conductive filler being composite particles including copper powder and nanosize precipitates which are disposed on the surface of the copper powder and composed of at least one kind of transition metal belonging to the group 8 to group 10 of the periodic table or a compound of the transition metal, and a binder resin.

Provided is a dendritic silver-coated copper powder which is prevented from agglomeration, while ensuring excellent electrical conductivity by increasing contact points in cases where silver-coated dendritic copper powder particles are in contact with each other. This dendritic silver-coated copper powder is suitable for use in conductive pastes, electromagnetic shielding materials and the like. A dendritic silver-coated copper powder 1 according to the present invention has a dendritic form which comprises a linearly grown main trunk 2 and a plurality of branches 3 arising from the main trunk 2. The main trunk 2 and the branches 3 are configured of copper particles which have plate-like shapes having an average cross-sectional thickness of 0.2-1.0 μm, and the surfaces of which are coated with silver. This dendritic silver-coated copper powder 1 has an average particle diameter (D50) of 5.0-30 μm as determined by a laser diffraction/scattering particle size distribution measuring method.

Provided is a dendritic silver-coated copper powder which is prevented from agglomeration, while ensuring excellent electrical conductivity by increasing contact points in cases where silver-coated dendritic copper powder particles are in contact with each other. This dendritic silver-coated copper powder is suitable for use in conductive pastes, electromagnetic shielding materials and the like. A dendritic silver-coated copper powder 1 according to the present invention has a dendritic form which comprises a linearly grown main trunk 2 and a plurality of branches 3 arising from the main trunk 2. The main trunk 2 and the branches 3 are configured of copper particles which have plate-like shapes having an average cross-sectional thickness of 0.2-1.0 μm, and the surfaces of which are coated with silver. This dendritic silver-coated copper powder 1 has an average particle diameter (D50) of 5.0-30 μm as determined by a laser diffraction/scattering particle size distribution measuring method.

A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of solid epoxy resin that is solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin that is liquid at normal temperature, (B) 200 to 1800 parts by mass of silver-coated copper alloy particles in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A), and (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).

A resin coated inorganic or metallic pigment includes inorganic or metallic particles (A) and an acrylic copolymer (B) formed on the inorganic or metallic particles (A) by subjecting a radically polymerizable unsaturated carboxylic acid or radically polymerizable phosphate monomer (B1) and a monomer (B2) containing 3 to 6 (meth)acryloyloxy groups per molecule to radical polymerization reaction using a polymerization initiator (C) containing a nitrile group, wherein the inorganic or metallic particles (A) are coated with a coating resin including the acrylic copolymer (B), and the acrylic copolymer (B) has at a tail thereof a structure which is derived from the polymerization initiator (C) and which is represented by the following general formula (1): ##STR00001##
wherein R.sup.1 represents a methyl group, and R.sup.2 represents an alkyl group having 2 to 5 carbon atoms, or the like.

A resin coated inorganic or metallic pigment includes inorganic or metallic particles (A) and an acrylic copolymer (B) formed on the inorganic or metallic particles (A) by subjecting a radically polymerizable unsaturated carboxylic acid or radically polymerizable phosphate monomer (B1) and a monomer (B2) containing 3 to 6 (meth)acryloyloxy groups per molecule to radical polymerization reaction using a polymerization initiator (C) containing a nitrile group, wherein the inorganic or metallic particles (A) are coated with a coating resin including the acrylic copolymer (B), and the acrylic copolymer (B) has at a tail thereof a structure which is derived from the polymerization initiator (C) and which is represented by the following general formula (1): ##STR00001##
wherein R.sup.1 represents a methyl group, and R.sup.2 represents an alkyl group having 2 to 5 carbon atoms, or the like.

A thin film structure including a reflector layer; and a hybrid layer including an organic colored material and at least one of an organic filler and an inorganic filler; wherein a concentration of the at least one of an organic filler or an inorganic filler is in a range of from about 3 wt. % to about 30 wt. %. A method of making a thin film structure is also disclosed.