Patent classifications
C09C1/68
Methods of making polycrystalline diamond bodies having annular regions with differing characteristics
Polycrystalline diamond bodies having an annular region of diamond grains and a core region of diamond grains and methods of making the same are disclosed. In one embodiment, a polycrystalline diamond body includes an annular region of inter-bonded diamond grains having a first characteristic property and a core region of inter-bonded diamond grains bonded to the annular region and having a second characteristic property that differs from the first characteristic property. The annular region decreases in thickness from a perimeter surface of the polycrystalline diamond body towards a centerline axis.
Super-hard structure, tool element and method of making same
A method for treating a super-hard structure, the method including heating the super-hard structure to a treatment temperature of at least 500 degrees centigrade and cooling the super-hard structure from the treatment temperature to a temperature of less than 200 degrees centigrade at a mean cooling rate of at least 1 degree centigrade per second and at most 100 degrees centigrade per second to provide a treated super-hard structure. A PCBN structure produced by the method may have flexural strength of at least 650 MPa.
Polycrystalline diamond compacts including a cemented carbide substrate and applications therefor
Embodiments relate to a polycrystalline diamond compact (PDC) including a polycrystalline diamond (PCD) table having at least two regions and being bonded to a fine grained cemented tungsten carbide substrate. In an embodiment, a PDC includes a cemented carbide substrate having a cobalt-containing cementing constituent cementing tungsten carbide grains together that exhibit an average grain size of about 1.5 m or less, and a PCD table having at least one upper region including diamond grains exhibiting an upper average grain size and at least one lower region adjacent to the upper region a lower average grain size that may be at least two times greater than the upper average grain size. The cemented carbide substrate includes an interfacial surface and a depletion zone depleted of the cementing constituent that extends inwardly from the interfacial surface to a depth of, for example, about 30 m to about 60 m.
Polycrystalline diamond bodies incorporating fractionated distribution of diamond particles of different morphologies
Diamond bodies and methods of manufacture are disclosed. Diamond bodies are formed from at least a bimodal, alternatively a tri-modal or higher modal, feedstock having at least one fraction of modified diamond particles with a fine particle size (0.5-3.0 ?m) and at least one fraction of diamond particles with coarse particle size (15.0 to 30 ?m). During high pressurehigh temperature processing, fine particle sized, modified diamond particles in the first fraction preferentially fracture to smaller sizes while preserving the morphology of coarse particle sized diamond particles in the second fraction. Diamond bodies incorporating the two fractions have a microstructure including second fraction diamond particles dispersed in a continuous matrix of first fraction modified diamond particles and exhibit improved wear characteristics, particularly for wear associated with drilling of geological formations.
Cutting element and a method of manufacturing a cutting element
A cutting element includes a substrate and a cutting layer disposed on a surface of the substrate. The cutting layer includes an ultra hard material. The substrate includes tungsten carbide and a metal binder. The substrate has a magnetic saturation value in the range of from 80 to less than 85%. In another aspect, the magnetic saturation value may increase within the substrate along a gradient, wherein proximal to the interface with the cutting layer, the substrate has a magnetic saturation value in the range of from 80 to less than 85%. Drill bits incorporating such cutting elements and methods of manufacturing such cutting elements are described.
Cutting elements and methods for fabricating diamond compacts and cutting elements with functionalized nanoparticles
A method of fabricating a diamond compact includes functionalizing surfaces of diamond nanoparticles with fluorine; combining the functionalized diamond nanoparticles with a non-group-VIII metal to form a particle mixture; and subjecting the particle mixture to high pressure and high temperature (HPHT) conditions to form inter-granular bonds between the diamond nanoparticles. A cutting element for an earth-boring tool includes a plurality of grains of diamond material; a plurality of diamond nanoparticles bonded to the plurality of grains of diamond material; and a non-group-VIII metal fluoride disposed within interstitial spaces between the grains of diamond material and the plurality of diamond nanoparticles. The cutting element is substantially free of a metal-solvent catalyst.
Abrasive article including agglomerates having silicon carbide and an inorganic bond material
An abrasive article including a body including a bond material having an inorganic material including a ceramic, abrasive agglomerates including silicon carbide contained within the bond material, and a permeability of at least 60.
Polycrystalline diamond compacts and related methods
Embodiments of the invention relate to polycrystalline diamond compacts (PDCs) and methods of fabricating polycrystalline diamond tables and PDCs in a manner that facilitates removal of metal-solvent catalyst used in the manufacture of polycrystalline diamond tables of such PDCs.
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
A polishing liquid includes abrasive grains, an additive and water, wherein the abrasive grains include a tetravalent metal element hydroxide, and produce a liquid phase with a nonvolatile content of 500 ppm or greater when an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass % has been centrifuged for 50 minutes at a centrifugal acceleration of 1.5910.sup.5 G.
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
A polishing liquid includes abrasive grains, an additive and water, wherein the abrasive grains include a tetravalent metal element hydroxide, and produce a liquid phase with a nonvolatile content of 500 ppm or greater when an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass % has been centrifuged for 50 minutes at a centrifugal acceleration of 1.5910.sup.5 G.