The present invention relates to a resin composition including a modified petroleum resin having a structure in which a molecular weight regulator is bonded to at least one terminus of both terminuses of an at least partially hydrogenated or non-hydrogenated petroleum resin, wherein the modified petroleum resin comprises at least one styrene monomer-derived unit structure, wherein a Gardner color of the resin composition is 10 or less.

The present invention relates to a resin composition including a modified petroleum resin having a structure in which a molecular weight regulator is bonded to at least one terminus of both terminuses of an at least partially hydrogenated or non-hydrogenated petroleum resin, wherein the modified petroleum resin comprises at least one styrene monomer-derived unit structure, wherein a Gardner color of the resin composition is 10 or less.

A composition is described, which when applied to a surface, where it is desirable for snow and ice not to adhere, promotes release of snow and ice from the tire tread or surface for improved traction and performance. The composition is comprised of a binder polymer, a high molecular weight silicone oligomer or polymer(s) and a suitable delivery system permitting easy application, fast drying and excellent adhesion

A composition is described, which when applied to a surface, where it is desirable for snow and ice not to adhere, promotes release of snow and ice from the tire tread or surface for improved traction and performance. The composition is comprised of a binder polymer, a high molecular weight silicone oligomer or polymer(s) and a suitable delivery system permitting easy application, fast drying and excellent adhesion

A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: ##STR00001##
wherein R.sup.1 and R.sup.2 each represent a hydroxyl group or H.sub.2C?C(R.sup.7)COO; R.sup.3 and R.sup.4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R.sup.5, R.sup.6 and R.sup.7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R.sup.1 and R.sup.2 are never both a hydroxyl group. ##STR00002##

A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: ##STR00001##
wherein R.sup.1 and R.sup.2 each represent a hydroxyl group or H.sub.2C?C(R.sup.7)COO; R.sup.3 and R.sup.4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R.sup.5, R.sup.6 and R.sup.7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R.sup.1 and R.sup.2 are never both a hydroxyl group. ##STR00002##