C09D161/20

Laser-releasable bonding materials for 3-D IC applications

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

CARBOHYDRATE-BASED ADHESIVES

Various embodiments disclosed relate to a composition including a fibrous material and a binder composition. The binder composition includes at least one carbohydrate and at least one branched (poly)amine comprising a plurality of primary amines, wherein the majority of the plurality of primary amines are attached to a methylene group. Various embodiments disclosed further relate to a composition including a reaction product and a fibrous material mixed therein. The reaction product includes at least one monosaccharide and at least one branched (poly)amine comprising a plurality of primary amines, wherein each of the plurality of primary amines is attached to a methylene group. In various embodiments, the composition is used to make an engineered wood product.

CARBOHYDRATE-BASED ADHESIVES

Various embodiments disclosed relate to a composition including a fibrous material and a binder composition. The binder composition includes at least one carbohydrate and at least one branched (poly)amine comprising a plurality of primary amines, wherein the majority of the plurality of primary amines are attached to a methylene group. Various embodiments disclosed further relate to a composition including a reaction product and a fibrous material mixed therein. The reaction product includes at least one monosaccharide and at least one branched (poly)amine comprising a plurality of primary amines, wherein each of the plurality of primary amines is attached to a methylene group. In various embodiments, the composition is used to make an engineered wood product.

LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
20230187257 · 2023-06-15 ·

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

Flexible substrates comprising curable compositions containing acetoacetylated resins

This invention relates to an article of manufacture comprising at least one flexible substrate coated with at least one curable composition comprising: I. a first component (I) comprising at least one resin having at least one functional group selected from the group consisting of β-ketoester and malonate functional groups, II. a second component (II) comprising at least one curing agent having at least one aldehyde functional group, and III. a third component (III) comprising at least one compound having amine functionality, salts thereof, or combinations thereof.

Flexible substrates comprising curable compositions containing acetoacetylated resins

This invention relates to an article of manufacture comprising at least one flexible substrate coated with at least one curable composition comprising: I. a first component (I) comprising at least one resin having at least one functional group selected from the group consisting of β-ketoester and malonate functional groups, II. a second component (II) comprising at least one curing agent having at least one aldehyde functional group, and III. a third component (III) comprising at least one compound having amine functionality, salts thereof, or combinations thereof.

AQUEOUS DISPERSION OF RESIN PARTICLES
20220049116 · 2022-02-17 ·

An aqueous dispersion of resin particles comprising a dispersing group covalently bonded to the resin and at least one repeating unit of formula I, II and/or III and which is obtainable by contacting a compound A comprising 2 functional groups selected from the group of functional groups —X—C(=0)-CHR1-C(=0)-R2, —X—C(=0)-C≡C—R2; or —X—C(=0)-CR1=CR2-NR11 R12, wherein X, R1, R2, R3, R11 and R12 have the same meaning as that defined in the claims, with a compound B comprising at least two —NH.sub.2, —NH.sub.3.sup.+ or —N═C=0, with a crosslinking agent C. The invention also includes a method of producing the aqueous dispersion and further relates to an aqueous ink jet ink comprising the resin particles.

##STR00001##

Coating system, a method of applying the coating system and an article comprising the coating system

A coating system comprising an epoxy coating layer prepared from an epoxy formulation which comprises an epoxy resin; a curing agent with no more than 4.5 wt % free amine based on a weight solids of the curing agent; and an adjacent layer prepared from a non-isocyanate polyurethane formulation wherein the epoxy formulation and/or non-isocyanate polyurethane formulation optionally further comprise one or more additives selected from the group consisting of solvent, reactive diluent, plasticizer, pigment, filler; rheology modifiers, dispersants, surfactants, UV stabilizers, and corrosion inhibitors is provided. Also provided are a method of applying a multi-layer coating system and an article comprising a coating system.

RHEOLOGY MODIFIER AND COMPATIBILIZER
20210403746 · 2021-12-30 ·

The invention pertains to a comprising: a first resin and a second resin; and/or an adduct of a first resin and a second resin; and/or a first resin or second resin and a catalyst; and a polymeric particle having an average particle size of less than 100 micron, wherein the second resin and/or an adduct of a first resin and a second resin is present in an amount of at least 20 wt %, based on the total weight of the composition and wherein the polymeric particle has a glass transition temperature above the curing temperature.

RHEOLOGY MODIFIER AND COMPATIBILIZER
20210403746 · 2021-12-30 ·

The invention pertains to a comprising: a first resin and a second resin; and/or an adduct of a first resin and a second resin; and/or a first resin or second resin and a catalyst; and a polymeric particle having an average particle size of less than 100 micron, wherein the second resin and/or an adduct of a first resin and a second resin is present in an amount of at least 20 wt %, based on the total weight of the composition and wherein the polymeric particle has a glass transition temperature above the curing temperature.