A coating composition comprising: (a) a polymeric coating binder, wherein the polymeric coating binder comprises: (i) an aqueous polymer latex of a film forming carboxylated polymer; and (ii) a branched polyetheramine polyol dissolved in the aqueous phase of the polymer latex, wherein essentially all of the amino groups in the branched polyetheramine polyol are tertiary amine groups; and (b) a first filler, wherein the first filler comprises expanded polymeric microspheres; and (c) a second filler, wherein the second filler comprises expanded glass particles; wherein the coating composition comprises at least 0.1% by weight and at most 25% by weight of said first filler and second filler combined, based on the total weight of the composition. The invention also relates to the coating composition as an exterior wall masonry paint and to substrate having applied thereon a coating derived from the coating composition.

A coating composition comprising: (a) a polymeric coating binder, wherein the polymeric coating binder comprises: (i) an aqueous polymer latex of a film forming carboxylated polymer; and (ii) a branched polyetheramine polyol dissolved in the aqueous phase of the polymer latex, wherein essentially all of the amino groups in the branched polyetheramine polyol are tertiary amine groups; and (b) a first filler, wherein the first filler comprises expanded polymeric microspheres; and (c) a second filler, wherein the second filler comprises expanded glass particles; wherein the coating composition comprises at least 0.1% by weight and at most 25% by weight of said first filler and second filler combined, based on the total weight of the composition. The invention also relates to the coating composition as an exterior wall masonry paint and to substrate having applied thereon a coating derived from the coating composition.

Provided is a surfactant composition that can impart good polymerization stability, that can yield an aqueous resin dispersion having good wettability, and that can improve water resistance and water-resistant adhesive strength of a resin film formed from the aqueous resin dispersion. The surfactant composition according to the present invention includes a compound C1 represented by formula (1):

##STR00001##

(in formula (1), A.sup.1 represents an alkylene group having 10 to 14 carbon atoms, A.sup.2 represents an alkylene group having 2 to 4 carbon atoms, n is an average number of moles of an oxyalkylene group A.sup.2O added and is a number of 1 to 100, and X represents a hydrogen atom, a sulfate ester or a salt thereof, a phosphate ester or a salt thereof, or methylcarboxylic acid or a salt thereof); and a compound C2 represented by formula (2):

##STR00002##

(in formula (2), A.sup.1, A.sup.2, n, and X are as defined in formula (1)). A molar ratio C1/C2 of the compound C1 to the compound C2 is 99/1 to 84/16.

A fluorine-containing ether compound according to the present invention is expressed by the following formula (1) or the following formula (2):

Q.sup.1{—(R.sup.f12).sub.m2—O—(R.sup.f11O).sub.m1-A.sup.1}.sub.n1  Formula (1)

{A.sup.1-(OR.sup.f11).sub.m1—O—(R.sup.f12).sub.m2-}.sub.n2Q.sup.2-[(R.sup.f12).sub.m2—O—(R.sup.f11O).sub.m1—(R.sup.f12).sub.m2-Q.sup.3].sub.p—(R.sup.f12).sub.m2—O—(R.sup.f11O).sub.m1—(R.sup.f12).sub.m2-Q.sup.2-{(R.sup.f12).sub.m2—O—(R.sup.f11O).sub.m1-A.sup.1}.sub.n2  Formula (2),

wherein Q.sup.1, Q.sup.2, Q.sup.3, R.sup.f11, R.sup.f12, A.sup.1, n1, n2, m1, m2, and p are as described in the specification.

A fluorine-containing ether compound according to the present invention is expressed by the following formula (1) or the following formula (2):

Q.sup.1{—(R.sup.f12).sub.m2—O—(R.sup.f11O).sub.m1-A.sup.1}.sub.n1  Formula (1)

{A.sup.1-(OR.sup.f11).sub.m1—O—(R.sup.f12).sub.m2-}.sub.n2Q.sup.2-[(R.sup.f12).sub.m2—O—(R.sup.f11O).sub.m1—(R.sup.f12).sub.m2-Q.sup.3].sub.p—(R.sup.f12).sub.m2—O—(R.sup.f11O).sub.m1—(R.sup.f12).sub.m2-Q.sup.2-{(R.sup.f12).sub.m2—O—(R.sup.f11O).sub.m1-A.sup.1}.sub.n2  Formula (2),

wherein Q.sup.1, Q.sup.2, Q.sup.3, R.sup.f11, R.sup.f12, A.sup.1, n1, n2, m1, m2, and p are as described in the specification.

Adhesive compositions are described that significantly improve the adhesion of polymer overmold compositions to metal substrates in polymer-metal junctions. The adhesive compositions include one or more poly(aryl ether) polymers, where each of the poly(aryl ether) polymers is, independently, a poly(aryl ether sulfone) polymer or a poly(aryl ether ketone) polymer. The overmold composition includes at least one poly(aryl ether ketone) polymer. Polymer-Metal junctions can be formed by, for example, dip-coating, spin-coating, extruding, or injection molding the adhesive composition and/or the overmold composition onto the metal substrate. Desirable applications settings for the polymer-metal junctions described include, but are not limited to electrical wiring.

Adhesive compositions are described that significantly improve the adhesion of polymer overmold compositions to metal substrates in polymer-metal junctions. The adhesive compositions include one or more poly(aryl ether) polymers, where each of the poly(aryl ether) polymers is, independently, a poly(aryl ether sulfone) polymer or a poly(aryl ether ketone) polymer. The overmold composition includes at least one poly(aryl ether ketone) polymer. Polymer-Metal junctions can be formed by, for example, dip-coating, spin-coating, extruding, or injection molding the adhesive composition and/or the overmold composition onto the metal substrate. Desirable applications settings for the polymer-metal junctions described include, but are not limited to electrical wiring.

Provided is a composite cover plate including a substrate body, wherein the substrate body includes two surfaces that are arranged opposite, at least one surface is provided with an antistatic film layer; the antistatic film layer includes a perfluoropolyether mixture and a silane coupling agent. Further provided is a method for preparing a composite cover plate, including: providing a substrate body with two surfaces that are arranged opposite, and spraying an antistatic film layer on at least one surface of the substrate body; wherein the antistatic film layer includes a perfluoropolyether mixture and a silane coupling agent. Further provided is a display device including a display module and a composite cover plate covering the surface of the display module, wherein the composite cover plate is any composite cover plate provided herein, an antistatic film layer is arranged on a side of the composite cover plate away from the display module.

Provided is a composite cover plate including a substrate body, wherein the substrate body includes two surfaces that are arranged opposite, at least one surface is provided with an antistatic film layer; the antistatic film layer includes a perfluoropolyether mixture and a silane coupling agent. Further provided is a method for preparing a composite cover plate, including: providing a substrate body with two surfaces that are arranged opposite, and spraying an antistatic film layer on at least one surface of the substrate body; wherein the antistatic film layer includes a perfluoropolyether mixture and a silane coupling agent. Further provided is a display device including a display module and a composite cover plate covering the surface of the display module, wherein the composite cover plate is any composite cover plate provided herein, an antistatic film layer is arranged on a side of the composite cover plate away from the display module.

The present invention relates to a composition comprising; components a) b) and d); wherein, component a) is a metal compound having the structure (I), component b) is a spin on high carbon polymer, having a polymer backbone comprising mono-cyclic aromatic hydrocarbon, fused-ring ring hydrocarbon moieties, or mixtures of these, having a wt. % of carbon from about 81 wt. % to about 94 wt. %, which is soluble to at least about 5 wt. % in a spin casting solvent, and wherein at least one, of said mono-cyclic aromatic hydrocarbon or said fused-ring ring hydrocarbon moieties, present in said spin on high carbon polymer, is functionalized with at least one alkynyloxy moiety of structure (VIII), and component d) is a spin casting solvent. The present invention further relates to using this composition in methods for manufacturing electronic devices through either the formation of a patterned films of high K material comprised of a metal oxide on a semiconductor substrate, or through the formation of patterned metal oxide comprised layer overlaying a semiconductor substrate which may be used to selectively etch the semiconductor substrate with a fluorine plasma. ##STR00001##