An object of the present invention is to provide an improved partial discharge-resistant electrical insulating resin composition that can inhibit deterioration of an insulator due to partial discharge. The partial discharge-resistant electrical insulating resin composition of the present invention comprises boehmite alumina and a resin.

An object of the present invention is to provide an improved partial discharge-resistant electrical insulating resin composition that can inhibit deterioration of an insulator due to partial discharge. The partial discharge-resistant electrical insulating resin composition of the present invention comprises boehmite alumina and a resin.

Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

##STR00001##

Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

##STR00001##

A process for manufacturing a display device, an optical device or an illuminating device includes casting a polyamide solution onto a base at temperature below 200° C. to obtain a film, heating the film on the base at temperature sufficient to make the film solvent resistant and obtain a polyamide film, forming on a surface of the polyamide film one of a display element, an optical element and an illumination element to form a display device, an optical device or an illumination device, and de-bonding the base from the display device, the optical device or the illuminating device. The polyamide solution comprises a solvent, an aromatic polyamide dissolved in the solvent, and a multifunctional epoxyde, where the aromatic polyamide comprises at least one functional group that reacts with an epoxy group, the aromatic polyamide comprises a first repeat unit of formula (I) and a second repeat unit of formula (II)

##STR00001##

A process for manufacturing a display device, an optical device or an illuminating device includes casting a polyamide solution onto a base at temperature below 200° C. to obtain a film, heating the film on the base at temperature sufficient to make the film solvent resistant and obtain a polyamide film, forming on a surface of the polyamide film one of a display element, an optical element and an illumination element to form a display device, an optical device or an illumination device, and de-bonding the base from the display device, the optical device or the illuminating device. The polyamide solution comprises a solvent, an aromatic polyamide dissolved in the solvent, and a multifunctional epoxyde, where the aromatic polyamide comprises at least one functional group that reacts with an epoxy group, the aromatic polyamide comprises a first repeat unit of formula (I) and a second repeat unit of formula (II)

##STR00001##

A film-forming composition that contains a tricarbonyl-benzene hyperbranched-polymer cross-linker and a triazine-containing hyperbranch, as shown for example in the formula, can form a thin film that excels in terms of hardness and heat tolerance and exhibits a reduced decrease in index of refraction despite the addition of the cross-linker. ##STR00001##

A film-forming composition that contains a tricarbonyl-benzene hyperbranched-polymer cross-linker and a triazine-containing hyperbranch, as shown for example in the formula, can form a thin film that excels in terms of hardness and heat tolerance and exhibits a reduced decrease in index of refraction despite the addition of the cross-linker. ##STR00001##

A film-forming composition that contains a tricarbonyl-benzene hyperbranched-polymer cross-linker and a triazine-containing hyperbranch, as shown for example in the formula, can form a thin film that excels in terms of hardness and heat tolerance and exhibits a reduced decrease in index of refraction despite the addition of the cross-linker. ##STR00001##

The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300° C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.