The invention provides a composition that can provide a film exhibiting excellent adhesion to a substrate and having excellent non-stickiness. The composition contains a fluororesin, a heat-resistant resin, water, and a solvent having a boiling point of 205° C. or higher.

The invention provides a composition that can provide a film exhibiting excellent adhesion to a substrate and having excellent non-stickiness. The composition contains a fluororesin, a heat-resistant resin, water, and a solvent having a boiling point of 205° C. or higher.

An inkjet ink is provided. The inkjet ink includes a modified high-performance engineering plastic, a polar solvent, and a wetting agent. Additionally, a 3D printing method and a 3D printing object are provided. The modified high-performance engineering plastic includes modified polyphenylene sulfide, modified polyether-ether-ketone, modified polyether sulfone, modified polyphenylsulfone, or modified polysulfone.

The invention pertains to a side-chain epoxy-functionalized copolymer (P1) and to the process for preparing this copolymer (P1). The present invention also pertains to the use of the copolymer (P1) in the preparation of a membrane, a composite material or a coating. The present invention also relates to a resin composition comprising at least the copolymer (P1) according to the present invention.

The invention pertains to a side-chain epoxy-functionalized copolymer (P1) and to the process for preparing this copolymer (P1). The present invention also pertains to the use of the copolymer (P1) in the preparation of a membrane, a composite material or a coating. The present invention also relates to a resin composition comprising at least the copolymer (P1) according to the present invention.

A polyarylene ether comprising in polymerized form A) at least one tri- or higher functional compound and B) isosorbide, isomannide, isoidide or a mixture thereof, wherein the polyarylene ether is a polyarylene ether sulfone or a polyarylene ether ketone, a process for its preparation and its use in the preparation of a coating, film, fiber, foam, membrane or molded article.

A coating for a medical device or appliance may include a fluoropolymer and a polyimide. Such coatings may provide a lubricious exterior surface that facilitates insertion or displacement of a medical device in a body lumen. Some coatings that include a fluoropolymer and a polyimide may, among other functions and characteristics, provide increased strength and/or durability relative to some other coatings.

A coating for a medical device or appliance may include a fluoropolymer and a polyimide. Such coatings may provide a lubricious exterior surface that facilitates insertion or displacement of a medical device in a body lumen. Some coatings that include a fluoropolymer and a polyimide may, among other functions and characteristics, provide increased strength and/or durability relative to some other coatings.

The present invention provides an electrically insulating resin composition comprising a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, wherein the proportion of the polyamide resin is 1 to 45% by mass. The present invention also provides a laminate sheet obtained by bonding a plurality of sheet materials with a resin composition layer interposed therebetween, wherein the resin composition layer comprises a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, and the proportion of the polyamide resin is 1 to 45% by mass.

The present invention provides an electrically insulating resin composition comprising a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, wherein the proportion of the polyamide resin is 1 to 45% by mass. The present invention also provides a laminate sheet obtained by bonding a plurality of sheet materials with a resin composition layer interposed therebetween, wherein the resin composition layer comprises a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, and the proportion of the polyamide resin is 1 to 45% by mass.