A vehicle bond filler formulation is provided that includes a part A having curable resin and a monomer reactive diluent. A part B storage-separate, cure initiator package contains a free-radical cure initiator. At least one color changing dye adapted to change color upon mixing the part A and the part B and within ±5 minutes of cure of the curable resin to a sandable condition is present in either the part A or a separate part C, a guide coat colorant, or a combination thereof. A process of for repairing a vehicle body is also provided that includes mixing a part A containing the at least one color changing dye with the part B to form an internal guide coat mixture applied to a substrate of the vehicle body in need of repair. The mixture cures causing the color changing dye to the terminal change color within ±5 minutes of cure of the curable resin to a sandable condition.

A vehicle bond filler formulation is provided that includes a part A having curable resin and a monomer reactive diluent. A part B storage-separate, cure initiator package contains a free-radical cure initiator. At least one color changing dye adapted to change color upon mixing the part A and the part B and within ±5 minutes of cure of the curable resin to a sandable condition is present in either the part A or a separate part C, a guide coat colorant, or a combination thereof. A process of for repairing a vehicle body is also provided that includes mixing a part A containing the at least one color changing dye with the part B to form an internal guide coat mixture applied to a substrate of the vehicle body in need of repair. The mixture cures causing the color changing dye to the terminal change color within ±5 minutes of cure of the curable resin to a sandable condition.

A waterproof wax, a waterproof treatment method for a splicing part of floorboards and a splice floorboard, relating to floorboards. The waterproof wax includes 60-85% by weight of a first paraffin, 1-15% by weight of a silicone resin, 10-20% by weight of ethylene glycol dimethacrylate, 2-5% by weight of amino silicone oil and 0.1-1% by weight of alkenyl succinate.

A waterproof wax, a waterproof treatment method for a splicing part of floorboards and a splice floorboard, relating to floorboards. The waterproof wax includes 60-85% by weight of a first paraffin, 1-15% by weight of a silicone resin, 10-20% by weight of ethylene glycol dimethacrylate, 2-5% by weight of amino silicone oil and 0.1-1% by weight of alkenyl succinate.

A waterproof wax, a waterproof treatment method for a splicing part of floorboards and a splice floorboard, relating to floorboards. The waterproof wax includes 60-85% by weight of a first paraffin, 1-15% by weight of a silicone resin, 10-20% by weight of ethylene glycol dimethacrylate, 2-5% by weight of amino silicone oil and 0.1-1% by weight of alkenyl succinate.

Disclosed are a photoresist composition, a pixel definition structure and a manufacturing method thereof, and a display panel. The photoresist composition includes an organic film-forming resin, a superhydrophobic polymerizable monomer, a polyfunctional crosslinkable polymerizable monomer, a photoinitiator, an additive and a solvent.

Disclosed are a photoresist composition, a pixel definition structure and a manufacturing method thereof, and a display panel. The photoresist composition includes an organic film-forming resin, a superhydrophobic polymerizable monomer, a polyfunctional crosslinkable polymerizable monomer, a photoinitiator, an additive and a solvent.

The invention relates to the use of low levels of glycols and short chain diols to control air void formation in any polymerization reaction having carbonyl-containing monomers, and preferably carboxylic acid ester monomers, at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The glycols and short chain diols are used in the polymization mixture at levels of 0.5 to 10 weight percent, based on the carboxylic acid ester-containing monomer. It is believed the glycols and short chain diols hydrogen bond with the —(C═O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methyl methacrylate polymers and copolymers, either neat, or as a polymer composite system.

The invention relates to the use of low levels of glycols and short chain diols to control air void formation in any polymerization reaction having carbonyl-containing monomers, and preferably carboxylic acid ester monomers, at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The glycols and short chain diols are used in the polymization mixture at levels of 0.5 to 10 weight percent, based on the carboxylic acid ester-containing monomer. It is believed the glycols and short chain diols hydrogen bond with the —(C═O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methyl methacrylate polymers and copolymers, either neat, or as a polymer composite system.

The present invention relates to an antimicrobial polymer coating composition including: a (meth)acrylate-based monomer or oligomer containing an alkylene oxide having 1 to 10 carbon atoms; a photosensitizer; and a photoinitiator, and an antimicrobial polymer film including a substrate layer including a polymer resin containing a (meth)acrylate-based repeating unit having an introduced alkylene oxide functional group having 1 to 10 carbon atoms, and a photosensitizer dispersed in the substrate layer, wherein the antimicrobial polymer film has surface energy of 32 mN/m or more.