The present invention relates to a process for electroplating an adhesive composition onto at least one conductive element, in which the conductive element is placed in contact with the adhesive composition comprising: a phosphate salt and a resin based on: a compound A1, compound A1 being chosen from a compound A11 comprising at least two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function, or a compound A12 comprising at least one aldehyde function, or a mixture of a compound A11 and of a compound A12; and a phenol A21. A potential difference is applied between the conductive element and the adhesive composition to coat the conductive element with an adhesive layer.

The present invention relates to a process for electroplating an adhesive composition onto at least one conductive element, in which the conductive element is placed in contact with the adhesive composition comprising: a phosphate salt and a resin based on: a compound A1, compound A1 being chosen from a compound A11 comprising at least two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function, or a compound A12 comprising at least one aldehyde function, or a mixture of a compound A11 and of a compound A12; and a phenol A21. A potential difference is applied between the conductive element and the adhesive composition to coat the conductive element with an adhesive layer.