C09D5/4473

Insulated conductor and insulated conductor manufacturing method

An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a low-concentration fluorine layer disposed on a surface side of the conductor and a high-concentration fluorine layer disposed on at least a part of an outside surface of the low-concentration fluorine layer, the low-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively lower than that of the high-concentration fluorine layer, and the high-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively higher than that of the low-concentration fluorine layer.

COATED METAL ALLOY SUBSTRATE AND PROCESS FOR PRODUCTION THEREOF
20220403528 · 2022-12-22 ·

A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

ELECTRODEPOSITABLE COATING COMPOSITIONS

The present invention is directed to an electrodepositable coating composition comprising an acrylic polymer comprising greater than 60% by weight of constitutional units comprising the residue of a hydroxyl-functional (meth)acrylate monomer and/or a hydroxyl-functional (meth)acrylamide monomer, based on the total weight of the acrylic polymer; and an ionic salt group-containing film-forming polymer different from the acrylic polymer. Also disclosed are coatings, coated substrates, and methods of coating a substrate.

Electrodepositable coating composition having improved crater control

The present invention is directed towards an electrodepositable coating composition comprising a polyfarnesene polymer and an ionic salt group-containing film-forming polymer. Also disclosed are methods of coating a substrate using the electrodepositable coating composition, coatings derived from the electrodepositable coating composition, and substrates coated with the coatings derived from the electrodepositable coating composition.

Process for electroplating an aqueous adhesive composition comprising a phosphate salt and a thermosetting resin on a conductive element

The present invention relates to a process for electroplating an adhesive composition onto at least one conductive element, in which the conductive element is placed in contact with the adhesive composition comprising: a phosphate salt and a resin based on: a compound A1, compound A1 being chosen from a compound A11 comprising at least two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function, or a compound A12 comprising at least one aldehyde function, or a mixture of a compound A11 and of a compound A12; and a phenol A21. A potential difference is applied between the conductive element and the adhesive composition to coat the conductive element with an adhesive layer.

CATIONIC ELECTRODEPOSITION COATING COMPOSITION

Provided is a cationic electrodeposition coating composition having good anti-cratering performance. A cationic electrodeposition coating composition comprising a coating film-forming resin (A), a metal compound (B) containing a trivalent metal element, and a silicone compound (C), wherein a content of the metal compound (B) is 0.03 parts by mass or more and less than 4 parts by mass in terms of a metal element based on 100 parts by mass of a resin solid content of the coating film-forming resin (A), and a content of the silicone compound (C) is 0.005 parts by mass or more and 4.5 parts by mass or less based on 100 parts by mass of the resin solid content of the coating film-forming resin (A).

TWO-LAYER DIELECTRIC COATING

The present invention is directed towards a system for coating a substrate comprising an electrodepositable coating composition and a powder coating composition. Also disclosed are coated substrates comprising a first coating layer comprising an electrodepositable coating layer, and a second coating layer comprising a powder coating layer on at least a portion of the first coating layer, as well as methods of coating substrates.

Cationic electrodeposition coating composition

A cationic electrodeposition paint composition comprising a cationic base-containing resin (A), a blocked polyisocyanate compound (B), and a modified imidazole (C) having a specific structure, wherein the cationic base-containing resin (A) is a cationic base-containing epoxy resin and/or a cationic base-containing acrylic resin.

Bismuth Containing Electrocoating Material with Improved Catalytic Activity

Disclosed herein is an aqueous electrocoating material including at least one specific binder and at least one bismuth compound, a method of using the aqueous electrocoating material for at least partially electrocoating a substrate, a coated substrate obtained from said method and an article or component including said substrate.

Insulated conductor and insulated conductor manufacturing method

An insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a fluorine-containing resin composition layer including a cured product of a thermosetting resin and a fluororesin and a fluorine concentration gradient layer which is disposed between the conductor and the fluorine-containing resin composition layer. The fluorine-containing resin composition layer includes a cured product of a thermosetting resin and a fluororesin, and is provided with a concentration gradient in which a fluorine atom content decreases from the fluorine-containing resin composition layer side toward the conductor.