Provided is a fiber for rubber reinforcement that can be produced using a bio-derived raw material and hardly breaks even when compounded with a rubber material. A first fiber for rubber reinforcement uses a protein fiber containing a hydrophobic protein. A second fiber for rubber reinforcement uses a protein fiber having an initial tensile modulus of elasticity of 2.0 GPa or more when wet. These fibers for rubber reinforcement preferably have a coating layer made of a water-based adhesive composition on the surface thereof.

Provided is a fiber for rubber reinforcement that can be produced using a bio-derived raw material and hardly breaks even when compounded with a rubber material. A first fiber for rubber reinforcement uses a protein fiber containing a hydrophobic protein. A second fiber for rubber reinforcement uses a protein fiber having an initial tensile modulus of elasticity of 2.0 GPa or more when wet. These fibers for rubber reinforcement preferably have a coating layer made of a water-based adhesive composition on the surface thereof.

The present invention relates to a spray adhesive essentially consisting of: (i) from 5 to 30% by weight of an adhesive mixture comprising one or more styrenic block copolymers, and optionally one or more tackifying resins, and either (ii) from 20 to 40% by weight of a mixture comprising hydrocarbon solvents and propellants, and (iii) from 30 to 75% by weight of a VOC-exempt diluent. The present invention also relates to a portable aerosol can, spray cylinder, cannister, or container onto which a nozzle for spraying can be provided, containing the spray adhesive.

The present invention relates to a spray adhesive essentially consisting of: (i) from 5 to 30% by weight of an adhesive mixture comprising one or more styrenic block copolymers, and optionally one or more tackifying resins, and either (ii) from 20 to 40% by weight of a mixture comprising hydrocarbon solvents and propellants, and (iii) from 30 to 75% by weight of a VOC-exempt diluent. The present invention also relates to a portable aerosol can, spray cylinder, cannister, or container onto which a nozzle for spraying can be provided, containing the spray adhesive.

An adhesive tape can reduce percussive sounds or friction sounds, can prevent contamination of a covered article due to contamination by dirt or dust or intrusion by water or oil, has durability against puncture or friction, and easily bends after binding a covered article. The adhesive tape having a substrate including 100 parts by mass of a polyvinyl chloride and, with respect to the 100 parts by mass of the polyvinyl chloride, 10-100 parts by mass of an elastomer and 10-100 parts by mass of a plasticizer, wherein the elastomer includes an acrylonitrile monomer unit and at least one monomer unit selected from the group made of a chloroprene monomer unit, a butadiene monomer unit, and an isoprene monomer unit and the adhesive tape has an attenuation value of 2 dB or greater in an acoustic absorption test.

The present invention relates to a foamed pressure-sensitive adhesive compound on the basis of aromatic polyvinyl-polydiene block copolymers, in particular for double-sided self-adhesive strips, containing a) 39.8 wt. % to 51.8 wt. % of an elastomer component, b) 35.0 wt. % to 58.0 wt % of an adhesive resin component, c) 2.0 wt. % to 15.0 wt. % of a plasticizer component, d) 0.0 wt. % to 18.0 wt. % of further additives and e) microballoons, the microballoons being at least partly expanded.

The present invention relates to a foamed pressure-sensitive adhesive compound on the basis of aromatic polyvinyl-polydiene block copolymers, in particular for double-sided self-adhesive strips, containing a) 39.8 wt. % to 51.8 wt. % of an elastomer component, b) 35.0 wt. % to 58.0 wt % of an adhesive resin component, c) 2.0 wt. % to 15.0 wt. % of a plasticizer component, d) 0.0 wt. % to 18.0 wt. % of further additives and e) microballoons, the microballoons being at least partly expanded.

Disclosed is a curable composition comprising an elastomer (A), an epoxy resin (B) and a latent curing agent (C), wherein the latent curing agent (C) comprises a combination of two or more latent curing agents.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.