The present disclosure discloses a low-water-vapor-permeability polyolefin-elastomer film and its preparation method. The film comprises: 50-100 mass parts of a matrix resin, 0-40 mass parts of a modified resin, 0.001-2 mass parts of an activator, 0.1-3 mass parts of an organic peroxide, 0.02-5 mass parts of an assistant cross-linker, 0.02-2 mass parts of a silane coupling agent, 0.005-2 mass parts of a light stabilizer, and 0-20 mass parts of a water blocking filler. In the present disclosure, by adding the modified resin and the activator that have an active group, a cross-linking degree and a cross-linking density of the film are improved, and a water-vapor permeability is reduced; by adding the water blocking filler, the water blocking property of the film is further improved, thereby ensuring reliability of the assembly, and prolonging service life of the assembly.

The present disclosure discloses a low-water-vapor-permeability polyolefin-elastomer film and its preparation method. The film comprises: 50-100 mass parts of a matrix resin, 0-40 mass parts of a modified resin, 0.001-2 mass parts of an activator, 0.1-3 mass parts of an organic peroxide, 0.02-5 mass parts of an assistant cross-linker, 0.02-2 mass parts of a silane coupling agent, 0.005-2 mass parts of a light stabilizer, and 0-20 mass parts of a water blocking filler. In the present disclosure, by adding the modified resin and the activator that have an active group, a cross-linking degree and a cross-linking density of the film are improved, and a water-vapor permeability is reduced; by adding the water blocking filler, the water blocking property of the film is further improved, thereby ensuring reliability of the assembly, and prolonging service life of the assembly.

Described herein is an adhesive composition including a copolymer. The adhesive composition has a viscosity of from about 2,000 mPa.Math.s to about 11,500 mPa.Math.s at 150° C. The adhesive composition has a Storage Modulus at 37° C. of from about 3 MPa to 9.5 MPa. The adhesive composition has a Yield Stress at 37° C. of from about 0.8 MPa to about 1.45 MPa.

A hot-melt adhesive composition, which can be used for bonding of expanded polystyrene foam plates and expanded extruded polystyrene foam plates. The adhesive composition includes at least one at 25° C. solid poly-α-olefin, at least one tackifying resin, and at least one organic phosphorus-containing compound. The invention also uses adhesive composition for bonding of plastic foam plates, to a method for producing a composite element, and to a composite element including a first and second substrate bonded to each via a layer of adhesive composition of the present invention.

A hot-melt adhesive composition, which can be used for bonding of expanded polystyrene foam plates and expanded extruded polystyrene foam plates. The adhesive composition includes at least one at 25° C. solid poly-α-olefin, at least one tackifying resin, and at least one organic phosphorus-containing compound. The invention also uses adhesive composition for bonding of plastic foam plates, to a method for producing a composite element, and to a composite element including a first and second substrate bonded to each via a layer of adhesive composition of the present invention.

A hot-melt adhesive composition, which can be used for bonding of expanded polystyrene foam plates and expanded extruded polystyrene foam plates. The adhesive composition includes at least one at 25° C. solid poly-α-olefin, at least one tackifying resin, and at least one organic phosphorus-containing compound. The invention also uses adhesive composition for bonding of plastic foam plates, to a method for producing a composite element, and to a composite element including a first and second substrate bonded to each via a layer of adhesive composition of the present invention.

An object of the present invention is to provide a pressure-sensitive adhesive sheet, an optical member, and a touch panel that enable a pressure-sensitive adhesive layer to be formed, the pressure-sensitive adhesive layer allowing the appearance of a display device and an input device to be unlikely to deteriorate even under low pressure conditions. The pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer, and the number of the voids having a diameter of 300 μM or more in the following low pressure test is less than 10, and the number of the voids having a diameter of not less than 50 less than 300 μM in the following low pressure test is less than 20.

A hot-melt adhesive composition is disclosed. The hot melt adhesive comprises a) 25 to 95 wt %, preferably 50 to 85 wt % of at least one polyolefin-based polymer; b) 1 to 75 wt %, preferably 1 to 40 wt % of at least one tackifying resin; c) 0 to 15 wt % of at least one plasticizer; and d) 0 to 30 wt % of at least one additive and/or adjuvant selected from among stabilizers, adhesion promoters, fillers or pigments, waxes, and/or other polymers or combinations thereof,
characterized in that the at least one polyolefin-based polymer is a mixture of: a1) at least one first polyolefin-based polymer with a molecular weight M.sub.n of <10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer, and a2) at least one second polyolefin-based polymer with a molecular weight M.sub.n of >10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer. The adhesive is particularly useful for gluing polyolefin films, woven fabrics, or nonwoven fabrics. Also, methods for manufacturing packaging and fabric with the hot-melt adhesive above are disclosed.

A hot-melt adhesive composition is disclosed. The hot melt adhesive comprises a) 25 to 95 wt %, preferably 50 to 85 wt % of at least one polyolefin-based polymer; b) 1 to 75 wt %, preferably 1 to 40 wt % of at least one tackifying resin; c) 0 to 15 wt % of at least one plasticizer; and d) 0 to 30 wt % of at least one additive and/or adjuvant selected from among stabilizers, adhesion promoters, fillers or pigments, waxes, and/or other polymers or combinations thereof,
characterized in that the at least one polyolefin-based polymer is a mixture of: a1) at least one first polyolefin-based polymer with a molecular weight M.sub.n of <10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer, and a2) at least one second polyolefin-based polymer with a molecular weight M.sub.n of >10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer. The adhesive is particularly useful for gluing polyolefin films, woven fabrics, or nonwoven fabrics. Also, methods for manufacturing packaging and fabric with the hot-melt adhesive above are disclosed.

A hot-melt adhesive composition is disclosed. The hot melt adhesive comprises a) 25 to 95 wt %, preferably 50 to 85 wt % of at least one polyolefin-based polymer; b) 1 to 75 wt %, preferably 1 to 40 wt % of at least one tackifying resin; c) 0 to 15 wt % of at least one plasticizer; and d) 0 to 30 wt % of at least one additive and/or adjuvant selected from among stabilizers, adhesion promoters, fillers or pigments, waxes, and/or other polymers or combinations thereof,
characterized in that the at least one polyolefin-based polymer is a mixture of: a1) at least one first polyolefin-based polymer with a molecular weight M.sub.n of <10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer, and a2) at least one second polyolefin-based polymer with a molecular weight M.sub.n of >10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer. The adhesive is particularly useful for gluing polyolefin films, woven fabrics, or nonwoven fabrics. Also, methods for manufacturing packaging and fabric with the hot-melt adhesive above are disclosed.