A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

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A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

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The invention relates to a method for preparing hydrogenated petroleum resin. More specifically, the invention relates to a method for preparing hydrogenated petroleum resin having aromaticity of 10% or more and exhibiting excellent color and thermal stability, through a hydrogenation reaction in a slurry reactor, using a selective hydrogenation catalyst having excellent selectivity to olefinic double bonds in petroleum resin.

The present disclosure relates to a multilayer pressure sensitive adhesive assembly comprising a polymeric foam layer and a first pressure sensitive adhesive layer adjacent to the polymeric foam layer, wherein first the pressure sensitive adhesive comprises: a) a multi-arm block copolymer of the formula Q.sub.n-Y, wherein: (i) Q represents an arm of the multi-arm block copolymer and each arm independently has the formula G-R, (ii) n represents the number of arms and is a whole number of at least 3, and (iii) Y is the residue of a multifunctional coupling agent,  wherein each R is a rubbery block comprising a polymerized conjugated diene, a hydrogenated derivative of a polymerized conjugated diene, or combinations thereof; and each G is a glassy block comprising a polymerized monovinyl aromatic monomer; b) a polymeric plasticizer having a weight average molecular weight Mw of at least 10,000 g/mol; c) at least one hydrocarbon tackifier, wherein the hydrocarbon tackifier(s) have a Volatile Organic Compound (VOC) value of less than 1000 ppm, when measured by thermogravimetric analysis according to the weight loss test methods described in the experimental section; and d) optionally, a linear block copolymer of the formula L-(G).sub.m, wherein L is a rubbery block comprising a polymerized olefin, a polymerized conjugated diene, a hydrogenated derivative of a polymerized conjugated diene, or any combinations thereof; and wherein m is 1 or 2;
wherein the multilayer pressure sensitive adhesive assembly is obtained by hotmelt co-extrusion of the polymeric foam layer and the first pressure sensitive adhesive layer.

The present disclosure also relates to a method of manufacturing such a multilayer pressure sensitive adhesive assembly and uses thereof.

The present disclosure relates to a multilayer pressure sensitive adhesive assembly comprising a polymeric foam layer and a first pressure sensitive adhesive layer adjacent to the polymeric foam layer, wherein first the pressure sensitive adhesive comprises: a) a multi-arm block copolymer of the formula Q.sub.n-Y, wherein: (i) Q represents an arm of the multi-arm block copolymer and each arm independently has the formula G-R, (ii) n represents the number of arms and is a whole number of at least 3, and (iii) Y is the residue of a multifunctional coupling agent,  wherein each R is a rubbery block comprising a polymerized conjugated diene, a hydrogenated derivative of a polymerized conjugated diene, or combinations thereof; and each G is a glassy block comprising a polymerized monovinyl aromatic monomer; b) a polymeric plasticizer having a weight average molecular weight Mw of at least 10,000 g/mol; c) at least one hydrocarbon tackifier, wherein the hydrocarbon tackifier(s) have a Volatile Organic Compound (VOC) value of less than 1000 ppm, when measured by thermogravimetric analysis according to the weight loss test methods described in the experimental section; and d) optionally, a linear block copolymer of the formula L-(G).sub.m, wherein L is a rubbery block comprising a polymerized olefin, a polymerized conjugated diene, a hydrogenated derivative of a polymerized conjugated diene, or any combinations thereof; and wherein m is 1 or 2;
wherein the multilayer pressure sensitive adhesive assembly is obtained by hotmelt co-extrusion of the polymeric foam layer and the first pressure sensitive adhesive layer.

The present disclosure also relates to a method of manufacturing such a multilayer pressure sensitive adhesive assembly and uses thereof.

Provided are a composition for forming an adhesive film for imprinting, including a resin having a specific aromatic ring and a polymerizable functional group in a side chain, in which the specific aromatic ring is an unsubstituted aromatic ring, or an aromatic ring having one or more substituents, in which a formula weight of each of the one or more substituents is 1000 or less, and a proportion of a polymerizable functional group including a heterocyclic ring in the polymerizable functional group is less than 3 mol %; an adhesive film to which the composition for forming an adhesive film is applied; a laminate; a method for manufacturing a laminate; a pattern producing method; and a method for manufacturing a semiconductor element.

Provided are a composition for forming an adhesive film for imprinting, including a resin having a specific aromatic ring and a polymerizable functional group in a side chain, in which the specific aromatic ring is an unsubstituted aromatic ring, or an aromatic ring having one or more substituents, in which a formula weight of each of the one or more substituents is 1000 or less, and a proportion of a polymerizable functional group including a heterocyclic ring in the polymerizable functional group is less than 3 mol %; an adhesive film to which the composition for forming an adhesive film is applied; a laminate; a method for manufacturing a laminate; a pattern producing method; and a method for manufacturing a semiconductor element.

Provided is a solvent-free-adhesive polyisocyanate composition, containing, a polyisocyanate (A) and an aromatic vinyl-maleic anhydride copolymer (B), which is a copolymer of aromatic vinyl and maleic anhydride in which a molar ratio [aromatic vinyl/maleic anhydride] of the raw material monomers of the copolymer is 1.5/1 to 5/1. Further provided is a method for producing the polyisocyanate composition; a solvent-free adhesive containing, the solvent-free-adhesive polyisocyanate composition and a polyol (Y); and a multilayer film obtained by laminating a first base material film, a second base material film, and an adhesive layer between the base material films, in which the adhesive layer is formed of the solvent-free adhesive.

Provided is a solvent-free-adhesive polyisocyanate composition, containing, a polyisocyanate (A) and an aromatic vinyl-maleic anhydride copolymer (B), which is a copolymer of aromatic vinyl and maleic anhydride in which a molar ratio [aromatic vinyl/maleic anhydride] of the raw material monomers of the copolymer is 1.5/1 to 5/1. Further provided is a method for producing the polyisocyanate composition; a solvent-free adhesive containing, the solvent-free-adhesive polyisocyanate composition and a polyol (Y); and a multilayer film obtained by laminating a first base material film, a second base material film, and an adhesive layer between the base material films, in which the adhesive layer is formed of the solvent-free adhesive.

A curable and hygroscopic resin composition for sealing electronic devices, comprising: a radically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a photo-radical polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. ##STR00001## wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of O, S, CO, and NH, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.