The present invention is a material for forming an adhesive film formed between a silicon-containing middle layer film and a resist upper layer film, the material for forming an adhesive film containing: (A) a resin having a structural unit shown by the following general formula (1); (B) a crosslinking agent containing one or more compounds shown by the following general formula (2); (C) a photo-acid generator; and (D) an organic solvent. This provides: a material for forming an adhesive film in a fine patterning process by a multilayer resist method in a semiconductor device manufacturing process, where the material gives an adhesive film that has high adhesiveness to a resist upper layer film, has an effect of suppressing fine pattern collapse, and that also makes it possible to form an excellent pattern profile; a patterning process using the material; and a method for forming the adhesive film.

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Embodiments of this invention relate to adhesives, and more particularly to biomimetic heteropolymer adhesive compositions. Certain embodiments relate to biomimetic terpolymer adhesive compositions including dopamine methacrylamide, 3,4-dihydroxyphenylalanine, or 3,4-dihydroxystyrene, mimicking moieties found in marine mussel adhesive proteins. In some embodiments, elastic moduli of the adhesives are preferably selected to match the elastic moduli of the substrates to minimize stress concentrations, to increase the ductility of the adhesive-substrate system, or both.

Embodiments of this invention relate to adhesives, and more particularly to biomimetic heteropolymer adhesive compositions. Certain embodiments relate to biomimetic terpolymer adhesive compositions including dopamine methacrylamide, 3,4-dihydroxyphenylalanine, or 3,4-dihydroxystyrene, mimicking moieties found in marine mussel adhesive proteins. In some embodiments, elastic moduli of the adhesives are preferably selected to match the elastic moduli of the substrates to minimize stress concentrations, to increase the ductility of the adhesive-substrate system, or both.

Disclosed herein is a bio-based copolymer comprising in polymerized form (i) at least one polymerizable bio-based monomer containing one phenolic hydroxyl group which has been derivatized to provide at least one polymerizable functional group which is an ethylenically unsaturated functional group (such as a [meth]acrylate group), where the precursors of the polymerizable bio-based monomers are derived from raw lignin-containing biomass, and (ii) at least one ion-conducting co-monomer other than the bio-based monomer. Also disclosed herein are binders comprising the bio-based copolymer, electrodes comprising the binder, polymer electrolytes comprising the bio-based copolymer and an electrochemical device comprising an electrode in electrical contact with a polymer electrolyte, wherein at least one of the electrode and the polymer electrolyte comprises the bio-based copolymer.

Disclosed herein is a bio-based copolymer comprising in polymerized form (i) at least one polymerizable bio-based monomer containing one phenolic hydroxyl group which has been derivatized to provide at least one polymerizable functional group which is an ethylenically unsaturated functional group (such as a [meth]acrylate group), where the precursors of the polymerizable bio-based monomers are derived from raw lignin-containing biomass, and (ii) at least one ion-conducting co-monomer other than the bio-based monomer. Also disclosed herein are binders comprising the bio-based copolymer, electrodes comprising the binder, polymer electrolytes comprising the bio-based copolymer and an electrochemical device comprising an electrode in electrical contact with a polymer electrolyte, wherein at least one of the electrode and the polymer electrolyte comprises the bio-based copolymer.

The present invention relates to an adhesive agent composition, containing an aqueous resin dispersion obtained by subjecting a polymerizable compound (C) containing a compound (C1) having a carbon-carbon unsaturated bond to an emulsion polymerization in the presence of a surfactant (A) and a surfactant (B) free from a radical-polymerizable substituent.

The present invention relates to an adhesive agent composition, containing an aqueous resin dispersion obtained by subjecting a polymerizable compound (C) containing a compound (C1) having a carbon-carbon unsaturated bond to an emulsion polymerization in the presence of a surfactant (A) and a surfactant (B) free from a radical-polymerizable substituent.

A rubber reinforcement adhesive comprising water and the reaction product of phloroglucinol and tris(hydroxymethyl)nitromethane.

A rubber reinforcement adhesive comprising water and the reaction product of phloroglucinol and tris(hydroxymethyl)nitromethane.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.