Patent classifications
C09J127/20
Method of bonding perfluoroelastomeric materials to a surface
The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.
Method of bonding perfluoroelastomeric materials to a surface
The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.
FLUORINATED TACKIFIER FOR PRESSURE SENSITIVE ADHESIVES AND PRESSURE SENSITIVE ADHESIVES ARTICLES
Described herein is a low molecular weight fluorinated (meth)acrylate polymer comprising a plurality of pendent sulfonylamide groups, which is used as a tackifier in a pressure sensitive adhesive composition. Also described herein is a pressure sensitive adhesive composition comprising the low molecular weight fluorinated (meth)acrylate polymer, and articles comprising the pressure sensitive adhesive composition. The pressure sensitive adhesive preferably also comprises a high molecular weight polymer, which is derived from a (meth)acrylate monomer or is a fluoropolymer.
FLUORINATED TACKIFIER FOR PRESSURE SENSITIVE ADHESIVES AND PRESSURE SENSITIVE ADHESIVES ARTICLES
Described herein is a low molecular weight fluorinated (meth)acrylate polymer comprising a plurality of pendent sulfonylamide groups, which is used as a tackifier in a pressure sensitive adhesive composition. Also described herein is a pressure sensitive adhesive composition comprising the low molecular weight fluorinated (meth)acrylate polymer, and articles comprising the pressure sensitive adhesive composition. The pressure sensitive adhesive preferably also comprises a high molecular weight polymer, which is derived from a (meth)acrylate monomer or is a fluoropolymer.
Insulating coating material and use of same
An insulating coating material is provided herein. In some embodiments, the insulating coating material comprises an insulating film comprising a polyimide resin, wherein the insulating film, when measuring a tensile elasticity in accordance with ASTM D882, having a stress at 5% strain of 180 MPa or greater and a stress at 15% strain of 225 MPa or greater, wherein the stress at 15% strain is greater than the stress at 5% strain.
HEAT-RESISTANT TWO-LAYER HEAT-SHRINKABLE TUBE AND METHOD FOR COVERING OBJECT TO BE COVERED
A heat-resistant two-layer heat-shrinkable tube including an outer layer and an inner layer, and a method for covering an object to be covered with the heat-resistant two-layer heat-shrinkable tube. The outer layer consists of a cross-linked product of a resin composition containing a resin, such as a tetrafluoroethylene-ethylene copolymer with a melting point of 210 C. or more and 260 C. or less, and a cross-linking aid. The outer layer thermally shrinks at 250 C. or more and 280 C. or less. The inner layer consists of a hot-melt adhesive composed mainly of an acid-modified tetrafluoroethylene-ethylene copolymer or the like and having a shear viscosity of less than 10000 Pa.Math.s at 250 C. and at a shear rate of 10 s.sup.1.
ELECTRICALLY CONDUCTIVE ADHESIVES
Disclosed herein are electrically conductive adhesive compositions and their use in solar cell modules, wherein the electrically conductive adhesives comprise one or more olefinic carboxylic acids or derivatives thereof.
ELECTRICALLY CONDUCTIVE ADHESIVES
Disclosed herein are electrically conductive adhesive compositions and their use in solar cell modules, wherein the electrically conductive adhesives comprise one or more olefinic carboxylic acids or derivatives thereof.
Bonded Object, and Method for Manufacturing Bonded Object
An embodiment of the present invention relates to a bonded object or a method for manufacturing a bonded object, the bonded object having bases bonded therein while placing an adhesive layer in between, the adhesive layer being obtained from a fluororubber composition that contains at least one fluororubber selected from fluoroelastomer (FKM) and perfluoroelastomer (FFKM), and has a Mooney viscosity (ML 1+10) at 121? C., measured in accordance with ASTM D1646, of 80 to 115.
Bonded Object, and Method for Manufacturing Bonded Object
An embodiment of the present invention relates to a bonded object or a method for manufacturing a bonded object, the bonded object having bases bonded therein while placing an adhesive layer in between, the adhesive layer being obtained from a fluororubber composition that contains at least one fluororubber selected from fluoroelastomer (FKM) and perfluoroelastomer (FFKM), and has a Mooney viscosity (ML 1+10) at 121? C., measured in accordance with ASTM D1646, of 80 to 115.