The present invention relates to curable photochromic compositions which include an at least di-functional oxazoline functional material, an at least di-functional first carboxylic acid functional material, an optional second carboxylic acid functional material having at least three carboxylic acid groups, which optionally includes a carboxylic acid functional polymer, and a photochromic compound. The curable photochromic compositions have an equivalents ratio of oxazoline equivalents of the oxazoline functional material to a total carboxylic acid equivalents of the first and optional second carboxylic acid functional materials of from 0.5:1 to 10:1 when the second carboxylic acid functional material is not present, and from 0.5:1 to 3:1 when the second carboxylic acid functional material is present. The present invention, more particularly, relates to curable photochromic adhesive compositions, and curable photochromic coating compositions.

The invention relates to a process for the radical polymerization for preparing a copolymer, using specific monomers A, which have a glass transition temperature Tg of at least 0° and specific monomers B, which contain an aromatic heterocyclic group that contain at least one nitrogen atom in the ring. The invention also relates to copolymers that are obtained by the radical polymerization, to the use of same as accelerators in a curing reagent for adhesive compounds, and to adhesive strips containing same.

The present application discloses an adhesive composition comprising a polymer of the formulae A, B and C:

##STR00001##

and methods for using the adhesive composition.

##STR00002##

The present application discloses an adhesive composition comprising a polymer of the formulae A, B and C:

##STR00001##

and methods for using the adhesive composition.

##STR00002##

The present invention relates to: a dicyclopentadiene-based resin having excellent compatibility with a base resin and prepared by being copolymerized with a monomer composition comprising a dicyclopentadiene-based monomer and a vinylamide-based monomer; a dicyclopentadiene-based hydrogenated resin; and an adhesive resin composition comprising same. A dicyclopentadiene-based resin according to the present invention is advantageous in terms of having excellent compatibility with various base resins and being providable as an adhesive resin composition capable of achieving remarkably improved adhesive strength.

The present invention relates to: a dicyclopentadiene-based resin having excellent compatibility with a base resin and prepared by being copolymerized with a monomer composition comprising a dicyclopentadiene-based monomer and a vinylamide-based monomer; a dicyclopentadiene-based hydrogenated resin; and an adhesive resin composition comprising same. A dicyclopentadiene-based resin according to the present invention is advantageous in terms of having excellent compatibility with various base resins and being providable as an adhesive resin composition capable of achieving remarkably improved adhesive strength.

The present application discloses an adhesive composition comprising a polymer of the formulae A, B and C: ##STR00001##
and methods for using the adhesive composition. ##STR00002## wherein x and y define the block polymer and are integer greater than 1.

The present application discloses an adhesive composition comprising a polymer of the formulae A, B and C: ##STR00001##
and methods for using the adhesive composition. ##STR00002## wherein x and y define the block polymer and are integer greater than 1.

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.