A resin composition for temporary fixing, the resin composition containing (A) a thermoplastic resin, (B) a thermosetting resin, and (C) a silicone compound, the resin composition having a shear viscosity of 4000 Pa.Math.s or less at 120° C. and a rate of change in the shear viscosity being within 30% as determined before and after the resin composition is left to stand for 7 days in an atmosphere of 25° C.

A resin composition for temporary fixing, the resin composition containing (A) a thermoplastic resin, (B) a thermosetting resin, and (C) a silicone compound, the resin composition having a shear viscosity of 4000 Pa.Math.s or less at 120° C. and a rate of change in the shear viscosity being within 30% as determined before and after the resin composition is left to stand for 7 days in an atmosphere of 25° C.

A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided.

A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided.

An embodiment of the present invention provides an electrical steel sheet including: an upper adhesive layer positioned on an upper surface of an electrical steel sheet; and an lower adhesive layer positioned on a lower surface of the electrical steel sheet, wherein the upper adhesive layer has a pencil hardness of F or lower, and the lower adhesive layer has a pencil hardness of H or higher.

The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor chip mounted thereon; and a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member. The bonding adhesive member includes a sintered body of silver particles.

The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor chip mounted thereon; and a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member. The bonding adhesive member includes a sintered body of silver particles.

Binders, resinated furnishes, and methods for making composite lignocellulose products therefrom. The binder can include about 70 wt % to about 99.7 wt % of an aldehyde-based resin, about 0.3 wt % to about 30 wt % of an isocyanate-based resin, about 10 wt % to about 63 wt % of an extender, and about 145 wt % to about 230 wt % of water, where all weight percent values are based on a combined solids weight of the aldehyde-based resin and the isocyanate-based resin. The binder has a long pot life and can be used with lignocellulose substrates having a water content of 10 wt % or more.

Binders, resinated furnishes, and methods for making composite lignocellulose products therefrom. The binder can include about 70 wt % to about 99.7 wt % of an aldehyde-based resin, about 0.3 wt % to about 30 wt % of an isocyanate-based resin, about 10 wt % to about 63 wt % of an extender, and about 145 wt % to about 230 wt % of water, where all weight percent values are based on a combined solids weight of the aldehyde-based resin and the isocyanate-based resin. The binder has a long pot life and can be used with lignocellulose substrates having a water content of 10 wt % or more.

A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided.