Patent classifications
C09J163/02
Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module
Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH.sub.2OR.sup.1)(CH.sub.2OR.sup.2)(CH.sub.2OR.sup.3)(CH.sub.2OR.sup.4) (wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each independently hydrogen or C.sub.nH.sub.2nSH (wherein n is 2 to 6), at least one of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 is C.sub.nH.sub.2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.
Latent curing accelerators
A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[—X—CO—CH.sub.2—CN].sub.n(1), wherein A is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes —O—or —NR.sub.1—, wherein R.sub.1 is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70° C., is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.
Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator
Heat-curing epoxy resin compositions are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.
Fast-curing epoxy systems
The present invention provides a composition comprising a) at least one epoxy resin, b) at least one cyclic amine of the formula (I) ##STR00001##
in which R.sup.1 to R.sup.4 is H or an organic radical, with the proviso that at least one of the R.sup.1, R.sup.2, R.sup.3 and R.sup.4 radicals ═H, and
X═—(Y.sup.1).sub.m-(A.sup.1).sub.n-(Y.sup.2).sub.o-(A.sup.2).sub.p-(Y.sup.3).sub.q-(A.sup.3).sub.r-(Y.sup.4).sub.s— (II) where, independently of one another, m, n, o, p, q, r and s=0 or 1, A.sup.1, A.sup.2, A.sup.3=alkylene or alkenylene radical and Y.sup.1, Y.sup.2, Y.sup.3, Y.sup.4═NR.sup.5, PR.sup.5, O or S, where R.sup.5 independently=organic radical, where any two organic radicals selected from R.sup.1 to R.sup.5 and any radicals present in the alkylene and/or alkenylene radicals A.sup.1, A.sup.2, A.sup.3 may also form one or more further rings, with the proviso that at least one of the radicals selected from R.sup.1 to R.sup.5 present and any radicals present in the alkylene and/or alkenylene radicals A.sup.1, A.sup.2, A.sup.3 is substituted by at least one —NHR.sup.6 or —NH.sub.2 group, where R.sup.6=organic radical, and
c) at least one salt of a strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and unsubstituted ammonium ions,
where the ratio of the epoxy groups in the epoxy resin to the sum total of all NH groups in all amines is 0.5:1 to 1.5:1,
and to processes for production thereof and use thereof.
Resin composition for reinforcement and electronic component device
Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
Adhesive composition and film roll
An adhesive composition and a film roll whereby blocking can be prevented and excellent temporary pressure bonding properties can be obtained. The adhesive composition of the present invention contains an epoxy resin, a latent curing agent, and an acrylic rubber having a carboxyl group or a glycidyl group, and the acrylic rubber phase-separates from the epoxy resin at a normal temperature and is compatible with the epoxy resin at a predetermined temperature higher than the normal temperature and lower than the curing temperature. Adhesive force is thereby reduced at the normal temperature, blocking can be prevented from occurring and excellent adhesive force can be obtained during temporary pressure bonding.
Vacuum infusion adhesive and methods related thereto
An epoxy adhesive that is adapted to enable spray delivery and seamless polymerization during epoxy resin vacuum infusion techniques is disclosed. The epoxy adhesive can include one or more epoxy resins and one or more solvents that are used to dissolve the one or more epoxy resins. An adduct, a tackifier, and fumed silica can also be added to the adhesive.
Adhesive compositions
An adhesive composition comprising an aromatic epoxy resin, an epoxy resin rubber adduct, an amine curing agent; and optionally one or more of an oil absorbent, a corrosion inhibitor and a urone accelerator, wherein the adhesive composition is curable at 150 C. in no more than 210 seconds.
One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates
Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have some terminal isocyanate groups that are capped with a phenol and other terminal isocyanate groups that are capped with a hydroxy-functional acrylate or a hydroxy-functional methacrylate. In certain embodiments, the presence of both types of capping on the toughener leads to higher impact peel strengths and a greater level of cohesive failure, than when the toughener is capped with a phenol an hydroxy-functional acrylate or hydroxy-functional methacrylate alone.
Reactive liquid rubber made of blocked isocyanate-terminated prepolymers with glycol scavenger
A method is described for producing liquid rubber containing an impact-resistance modifier terminated by epoxy groups, the method including the reaction of an isocyanate-terminated prepolymer with an epoxy resin, which includes an epoxy compound including a primary or secondary hydroxyl group, in the presence of a compound selected from anhydrides, ketones and aldehydes as glycol scavengers, wherein the isocyanate-terminated prepolymer, the epoxy resin and the glycol scavenger are mixed with one another, or the epoxy resin is reacted with the glycol scavenger, before they are mixed with the isocyanate-terminated prepolymer. Gelling in the reaction mixture is avoided by the method. The resulting products are suitable for improving the impact resistance of epoxy resin compositions, particularly one-component or two-component epoxy resin adhesives.