Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formulae (I), (II), or (III): ##STR00001## ##STR00002##

Curable compositions for dynamic epoxy-based thermoset adhesives and/or sealants are provided. Methods of applying the compositions to form strong, low-stress, cured adhesive polymer films are also provided. The cured polymer films use crosslinkers that include disulfide and carbon-nitrogen bonds, wherein the disulfide bonds impart dynamic chemistry to the polymer network structure in order to the achieve adaptable thermoset adhesives and sealants.

Curable compositions for dynamic epoxy-based thermoset adhesives and/or sealants are provided. Methods of applying the compositions to form strong, low-stress, cured adhesive polymer films are also provided. The cured polymer films use crosslinkers that include disulfide and carbon-nitrogen bonds, wherein the disulfide bonds impart dynamic chemistry to the polymer network structure in order to the achieve adaptable thermoset adhesives and sealants.

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formulae (I), (II), or (III):

##STR00001## ##STR00002##

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formulae (I), (II), or (III):

##STR00001## ##STR00002##

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formulae (I), (II), or (III): ##STR00001##

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formulae (I), (II), or (III): ##STR00001##

Adhesives suitable for use with low surface energy materials are described. The adhesive contain an acrylic copolymer, a high glass transition temperature tackifier and a low glass transition temperature tackifier. The acrylic copolymer is the reaction product of a first alkyl(meth)acrylate having at least 5 carbon atoms in the alkyl group, a second alkyl(meth)acrylate having 1 to 4 carbon atoms in the alkyl group, and a vinyl carboxylic acid. Both tackifiers have a Tg greater than the Tg of the acrylic copolymer. The high glass transition temperature tackifier has a Tg of at least 20 C. and the low glass transition temperature tackifier has a Tg of less than 0 C.

Adhesives suitable for use with low surface energy materials are described. The adhesive contain an acrylic copolymer, a high glass transition temperature tackifier and a low glass transition temperature tackifier. The acrylic copolymer is the reaction product of a first alkyl(meth)acrylate having at least 5 carbon atoms in the alkyl group, a second alkyl(meth)acrylate having 1 to 4 carbon atoms in the alkyl group, and a vinyl carboxylic acid. Both tackifiers have a Tg greater than the Tg of the acrylic copolymer. The high glass transition temperature tackifier has a Tg of at least 20 C. and the low glass transition temperature tackifier has a Tg of less than 0 C.