C09J177/06

Chemical products for adhesive applications
11702538 · 2023-07-18 · ·

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

Chemical products for adhesive applications
11702538 · 2023-07-18 · ·

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

Chemical products for adhesive applications
11702538 · 2023-07-18 · ·

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

POLYAMIDE RESIN COMPOSITION

The present invention relates to a polyamide resin composition that is excellent in mechanical characteristics, bonding properties, calcium chloride resistance and fuel resistance and is suitably bonded to an acid-modified polyolefin, wherein the polyamide resin composition includes 40 to 93 mass % of an aliphatic polyamide resin (A) having an amino group concentration of 46 to 110 μmol/g, 2 to 10 mass % of an aromatic polyamide resin (B), 5 to 50 mass % of reinforcing fibers (C), and 0 to 53 mass % of a component (D) other than (A) to (C), and the total amount of (A) to (D) is 100 mass %, and wherein the amount of acid modification of the acid-modified polyolefin is 5 to 100 μmol/g.

POLYAMIDE RESIN COMPOSITION

The present invention relates to a polyamide resin composition that is excellent in mechanical characteristics, bonding properties, calcium chloride resistance and fuel resistance and is suitably bonded to an acid-modified polyolefin, wherein the polyamide resin composition includes 40 to 93 mass % of an aliphatic polyamide resin (A) having an amino group concentration of 46 to 110 μmol/g, 2 to 10 mass % of an aromatic polyamide resin (B), 5 to 50 mass % of reinforcing fibers (C), and 0 to 53 mass % of a component (D) other than (A) to (C), and the total amount of (A) to (D) is 100 mass %, and wherein the amount of acid modification of the acid-modified polyolefin is 5 to 100 μmol/g.

POLYETHERAMINES BASED ON 1,3-DIALCOHOLS

This invention relates to polyetheramines based on 1,3-dialcohols, in particular to an etheramine mixture comprising at least 90% by weight, based on the total weight of the etheramine mixture, of an amine of Formula (I) and/or (II),

##STR00001##

wherein R.sub.1-R.sub.12 are independently selected from H, alkyl, cycloalkyl, aryl, alkylaryl, or arylalkyl, wherein at least one of R.sub.1-R.sub.6 and at least one of R.sub.7-R.sub.12 is different from H, wherein A.sub.1-A.sub.9 are independently selected from linear or branched alkylenes having 2 to 18 carbon atoms, wherein Z.sub.1-Z.sub.4 are independently selected OH, CH.sub.2CH.sub.2CH.sub.2NH.sub.2, NH.sub.2, NHR′ or NR′R″, wherein the degree of amination is <50%, wherein R′ and R″ are independently selected from alkylenes having 2-6 carbon atoms, and wherein the sum of x+y is in the range of from 2 to 200, wherein x≧1 and y≧1; and x.sub.1+y.sub.1 is in the range of from 2 to 200.

Adhesive composition and structure comprising at least one layer of the said composition

The invention relates to an adhesive composition comprising at least one polyamide noted A, with a mean number of carbon atoms per nitrogen atom, noted C.sub.A, of between 4 and 8.5 and advantageously between 4 and 7; at least one polyamide noted B, with a melting point of greater than or equal to 180° C. and a mean number of carbon atoms per nitrogen atom, noted C.sub.B, of between 7 and 10 and advantageously between 7.5 and 9.5; at least one polyamide noted C, with a mean number of carbon atoms per nitrogen atom, noted C.sub.C, of between 9 and 18 and advantageously between 10 and 18; at least 50% by weight of the said composition being formed from one or more polyamides chosen from polyamides A, B and C, the mass-weighted mean of the heats of fusion of these polyamides in the said composition being greater than 25 J/g (DSC), the mean number of carbon atoms per nitrogen atom of the polyamides A, B and C also satisfying the following strict inequality: C.sub.A<C.sub.B<C.sub.C, and also to multilayer structures using the said composition.

Adhesive composition and structure comprising at least one layer of the said composition

The invention relates to an adhesive composition comprising at least one polyamide noted A, with a mean number of carbon atoms per nitrogen atom, noted C.sub.A, of between 4 and 8.5 and advantageously between 4 and 7; at least one polyamide noted B, with a melting point of greater than or equal to 180° C. and a mean number of carbon atoms per nitrogen atom, noted C.sub.B, of between 7 and 10 and advantageously between 7.5 and 9.5; at least one polyamide noted C, with a mean number of carbon atoms per nitrogen atom, noted C.sub.C, of between 9 and 18 and advantageously between 10 and 18; at least 50% by weight of the said composition being formed from one or more polyamides chosen from polyamides A, B and C, the mass-weighted mean of the heats of fusion of these polyamides in the said composition being greater than 25 J/g (DSC), the mean number of carbon atoms per nitrogen atom of the polyamides A, B and C also satisfying the following strict inequality: C.sub.A<C.sub.B<C.sub.C, and also to multilayer structures using the said composition.

Adhesive composition and structure comprising at least one layer of the said composition

The invention relates to an adhesive composition comprising at least one polyamide noted A, with a mean number of carbon atoms per nitrogen atom, noted C.sub.A, of between 4 and 8.5 and advantageously between 4 and 7; at least one polyamide noted B, with a melting point of greater than or equal to 180° C. and a mean number of carbon atoms per nitrogen atom, noted C.sub.B, of between 7 and 10 and advantageously between 7.5 and 9.5; at least one polyamide noted C, with a mean number of carbon atoms per nitrogen atom, noted C.sub.C, of between 9 and 18 and advantageously between 10 and 18; at least 50% by weight of the said composition being formed from one or more polyamides chosen from polyamides A, B and C, the mass-weighted mean of the heats of fusion of these polyamides in the said composition being greater than 25 J/g (DSC), the mean number of carbon atoms per nitrogen atom of the polyamides A, B and C also satisfying the following strict inequality: C.sub.A<C.sub.B<C.sub.C, and also to multilayer structures using the said composition.

STORAGE-STABLE, REACTIVE, PRESSURE-SENSITIVE ADHESIVE TAPE

A reactive PSA film that includes: (a) a polymeric film former matrix; (b) one or more reactive components; and (c) a reagent selected from an initiator, a curing agent and an activator. The component (b) is present at a mass fraction of 30%, as based on the sum of (a), (b) and (c). Further, ≥50 wt % of the polymer film former matrix is a crystallizable polymer which: (i) exhibits a crystallization enthalpy of <1 J/g in a DSC measurement on cooling at 10 K/min from at least 30K above a peak temperature of the melting peak of the matrix and ≥100° C.; and (ii) exhibits a crystallite fusion enthalpy of ≥15 mJ/mg in its pure state in a first heating curve of a DSC measurement at 10 K/min and after storage for ≥ one month from 15 to 25° C. and relative humidity from 30 to 70%.