Aspects of the present disclosure provide fluoropolymers and methods for forming and using such fluoropolymers. Fluoropolymers include polyfluorobenzoxazines and polyfluoroimides. Methods for forming polyphthalonitriles are also provided. The present disclosure is further directed to compositions containing one or more fluoropolymers and one or more metal oxides.

Aspects of the present disclosure provide fluoropolymers and methods for forming and using such fluoropolymers. Fluoropolymers include polyfluorobenzoxazines and polyfluoroimides. Methods for forming polyphthalonitriles are also provided. The present disclosure is further directed to compositions containing one or more fluoropolymers and one or more metal oxides.

Reactive ammonium carboxyl ate salts, polyamide amic acid oligomers, and polyamideimide oligomers are made from at least one aromatic diamine, at least one aromatic di-, tri-, or tetra-functional carboxylic acid or functional equivalent thereof, and at least one crosslinkable monomer or crosslinkable end-capper. The crosslinkable monomer or crosslinkable end-capper is reactive with the at least one aromatic diamine or at least one di-, tri- or tetra-functional aromatic carboxylic acid or functional equivalent thereof and has at least one unreacted functional group capable of chain extension and crosslinking after formation of the reactive polyamideimide oligomer. The reactive polyamide amic acid and polyamideimide oligomers have a number average molecular weight (M.sub.n) of about 1,000 to about 10,000 g/mol, calculated using the Carothers equation. The reactive ammonium carboxyl ate salts, polyamide amic acid oligomers, and polyamideimide oligomers are useful in a wide variety of functional materials, manufacturing methods, and articles.

Reactive ammonium carboxyl ate salts, polyamide amic acid oligomers, and polyamideimide oligomers are made from at least one aromatic diamine, at least one aromatic di-, tri-, or tetra-functional carboxylic acid or functional equivalent thereof, and at least one crosslinkable monomer or crosslinkable end-capper. The crosslinkable monomer or crosslinkable end-capper is reactive with the at least one aromatic diamine or at least one di-, tri- or tetra-functional aromatic carboxylic acid or functional equivalent thereof and has at least one unreacted functional group capable of chain extension and crosslinking after formation of the reactive polyamideimide oligomer. The reactive polyamide amic acid and polyamideimide oligomers have a number average molecular weight (M.sub.n) of about 1,000 to about 10,000 g/mol, calculated using the Carothers equation. The reactive ammonium carboxyl ate salts, polyamide amic acid oligomers, and polyamideimide oligomers are useful in a wide variety of functional materials, manufacturing methods, and articles.

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

Embodiments provide methods of disassembling apparel products. The methods include exposing an adhesive of the apparel product to a composition. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a material having an imine bond or an iminium bond. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component via the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Embodiments provide methods of disassembling apparel products. The methods include exposing an adhesive of the apparel product to a composition. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a material having an imine bond or an iminium bond. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component via the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

A resin composition contains a (A) thermoplastic component, a (B) thermosetting component, and a (C) inorganic filler, 5%-weight-reduction temperature of a hardened substance of the resin composition being 440 degrees C. or more.

Materials from the group consisting of a) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, in combination with one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates, wherein hybrid material and inorganic sol are crosslinked, b) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, c) one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates and d) one or more polyamides, polyimides and/or epoxy resins mixed with oxidic and/or non-oxidic metal and/or metalloid particles, preferably from the group of the oxides, nitrides, carbides and mixtures thereof,
are suitable as adhesive for the bonding of metals, plastics, concrete and/or ceramics.