Silicone polyoxamide and silicone polyoxamide-hydrazide copolymers comprise at least two repeating units of formula (I). In this formula, each R.sup.1 is independently an alkyl, haloalkyl, aralkyl, alkenyl, aryl, or aryl substituted with an alkyl, alkoxy, or halo; each Y is independently an alkylene, aralkylene, or a combination thereof; each G is independently a bond or a divalent residue equal to a diamine of formula R.sup.3HN-G-NHR.sup.3 minus the two —NHR.sup.3 groups; each R.sup.3 is independently hydrogen or alkyl or R.sup.3 taken together with G and with the nitrogen to which they are both attached form a heterocyclic group; each n is independently an integer of 0 to 300; each p is independently an integer of 1 to 25, and the average of p is 1.3 or greater; and each q is independently an integer of 1 to 2, and the average of q is no greater than 1.05.

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There is provided herein a curable polysiloxane composition comprising a reactive polysiloxane having the general structural formula (I):

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as described herein. There is provided a method of making the polysiloxane. In addition, there is provided a curable composition including the polysiloxane.

There is provided herein a curable polysiloxane composition comprising a reactive polysiloxane having the general structural formula (I):

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as described herein. There is provided a method of making the polysiloxane. In addition, there is provided a curable composition including the polysiloxane.

The present invention provides a silicone skeleton-containing polymer including a silicone skeleton shown by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000.

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This can provide a silicone skeleton-containing polymer that can easily form a fine pattern with a large film thickness, and can form a cured material layer (cured film) that is excellent in various film properties such as crack resistance and adhesion properties to a substrate, electronic parts, and a semiconductor device, particularly a base material used for a circuit board, and has high reliability as a film to protect electric and electronic parts and a film for bonding substrates; and a photo-curable resin composition that contains the polymer, a photo-curable dry film thereof, a laminate using these materials, and a patterning process.

The present invention provides a silicone skeleton-containing polymer including a silicone skeleton shown by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000.

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This can provide a silicone skeleton-containing polymer that can easily form a fine pattern with a large film thickness, and can form a cured material layer (cured film) that is excellent in various film properties such as crack resistance and adhesion properties to a substrate, electronic parts, and a semiconductor device, particularly a base material used for a circuit board, and has high reliability as a film to protect electric and electronic parts and a film for bonding substrates; and a photo-curable resin composition that contains the polymer, a photo-curable dry film thereof, a laminate using these materials, and a patterning process.

Dual temperature curable silicone compositions, articles made from such compositions, and methods for the manufacture and use thereof. In particular, a dual temperature curable silicone composition is manufactured from a composition comprising a vinyl silicone; a silicone hydride-containing crosslinker; a platinum-containing catalyst; and a peroxide catalyst.

Dual temperature curable silicone compositions, articles made from such compositions, and methods for the manufacture and use thereof. In particular, a dual temperature curable silicone composition is manufactured from a composition comprising a vinyl silicone; a silicone hydride-containing crosslinker; a platinum-containing catalyst; and a peroxide catalyst.

Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening agent and a compatibilizer which has at least one silane group and at least one epoxy terminal group. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.

Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening agent and a compatibilizer which has at least one silane group and at least one epoxy terminal group. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.

A temporary adhesive material for substrate processing adhesion to support the substrate opposite to a surface, the material including: a first temporary adhesive layer; and a second temporary adhesive layer distinct from the first layer, where at least one of the first layer and the second layer has a minimum viscosity of 1 Pa.Math.s or higher and 10,000 Pa.Math.s or lower within 130° C. to 250° C., where: the temporary adhesive material contains 10 parts by mass or more and 100 parts by mass or less of a siloxane bond-containing polymer having a weight-average of 3,000 or more and 700,000 or less as measured by GPC based on a total mass of 100 parts. A temporary material for substrate processing that facilitates the adhesion and separation, allows a quick layer formation, has dimensional resistance to thermal processes, and can raise the productivity of substrates; and manufacturing a laminate using the same.