A glassy adhesive including a composition containing at least: a polysilazane compound having structures represented by the following formulae (A-1) and (A-2) and not containing a hydrosilyl group; and a curing catalyst, where a mole ratio of the component (A-1) to the component (A-2), which is (A-1):(A-2), is within a range of 3:7 to 7:3, the composition has a non-volatile content of 50 mass % or more, when the composition being heated at 105° C. for 3 hours, and the curing catalyst is at least one selected from the group consisting of an organic acid, a simple substance of a d block element belonging to the fourth period of the periodic table, a platinum group element, and an amphoteric element, and a compound containing the element. This provides an adhesive that is low-cost, has high UV resistance, and in which cracks and so forth do not occur even after a reflow process.

##STR00001##

A glassy adhesive including a composition containing at least: a polysilazane compound having structures represented by the following formulae (A-1) and (A-2) and not containing a hydrosilyl group; and a curing catalyst, where a mole ratio of the component (A-1) to the component (A-2), which is (A-1):(A-2), is within a range of 3:7 to 7:3, the composition has a non-volatile content of 50 mass % or more, when the composition being heated at 105° C. for 3 hours, and the curing catalyst is at least one selected from the group consisting of an organic acid, a simple substance of a d block element belonging to the fourth period of the periodic table, a platinum group element, and an amphoteric element, and a compound containing the element. This provides an adhesive that is low-cost, has high UV resistance, and in which cracks and so forth do not occur even after a reflow process.

##STR00001##

A glassy adhesive including a composition containing at least: a polysilazane compound having structures represented by the following formulae (A-1) and (A-2) and not containing a hydrosilyl group; and a curing catalyst, where a mole ratio of the component (A-1) to the component (A-2), which is (A-1):(A-2), is within a range of 3:7 to 7:3, the composition has a non-volatile content of 50 mass % or more, when the composition being heated at 105° C. for 3 hours, and the curing catalyst is at least one selected from the group consisting of an organic acid, a simple substance of a d block element belonging to the fourth period of the periodic table, a platinum group element, and an amphoteric element, and a compound containing the element. This provides an adhesive that is low-cost, has high UV resistance, and in which cracks and so forth do not occur even after a reflow process.

##STR00001##

The invention is an adhesive composition comprising a silyl terminated prepolymer having a number molecular weight average (Mn) of about 8,000 to about 80,000 g/mole, a filler, and a silanol condensation reaction catalyst. The silyl terminated prepolymer is comprised of a polymeric backbone of alkylene oxide and at least three urethane groups and at least two terminal groups comprised of a silicon atom having at least two alkoxy silane groups, wherein each silicon atom in the terminal groups is separated from the urethane groups in the polymeric backbone by an amount of alkylene oxide that has a molecular weight of 200 to 15,000 g/mole.

Moisture curable compositions having a low modulus and a high resilience are prepared by curing a composition containing a first polymer which predominately contains two moisture-curable silyl groups, and a second polymer which is terminated by an alkoxy group and contains but a single moisture-curable silyl group, or a hydroxyl group.

A method for bonding together two substrates includes providing a molecular glue including glue molecules, each of the glue molecules having at least two —O—Si or —O—Al moieties; reacting a surface of a first substrate with the molecular glue to attach the glue molecules to the surface of the first substrate by at least one of the —O—Si or —O—Al moieties; and reacting a surface of a second substrate with the molecular glue to attach the glue molecules to the surface of the second substrate by at least another one of the —O—Si or —O—Al moieties. The method can be used for a variety of applications including manufacturing a vapor cell.

A method for bonding together two substrates includes providing a molecular glue including glue molecules, each of the glue molecules having at least two —O—Si or —O—Al moieties; reacting a surface of a first substrate with the molecular glue to attach the glue molecules to the surface of the first substrate by at least one of the —O—Si or —O—Al moieties; and reacting a surface of a second substrate with the molecular glue to attach the glue molecules to the surface of the second substrate by at least another one of the —O—Si or —O—Al moieties. The method can be used for a variety of applications including manufacturing a vapor cell.

The adhesive composition includes: a cyclic organosilazane compound of the following general formula (1): ##STR00001##
wherein R.sup.1s each independently represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and p represents an integer of 3 to 8; and a hydrolyzable group-containing organosilicon compound containing an alkoxysilane compound of the following general formula (2) and/or a partial hydrolytic condensate thereof:
R.sup.2.sub.x—Si(OR.sup.3).sub.4-x   (2)
wherein R.sup.2 represents an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms and optionally having an oxygen atom, R.sup.3 represents an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and x represents an integer of 0 to 2.

The adhesive composition includes: a cyclic organosilazane compound of the following general formula (1): ##STR00001##
wherein R.sup.1s each independently represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and p represents an integer of 3 to 8; and a hydrolyzable group-containing organosilicon compound containing an alkoxysilane compound of the following general formula (2) and/or a partial hydrolytic condensate thereof:
R.sup.2.sub.x—Si(OR.sup.3).sub.4-x   (2)
wherein R.sup.2 represents an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms and optionally having an oxygen atom, R.sup.3 represents an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and x represents an integer of 0 to 2.

The present application is directed to a multifunctional coating for operation at temperatures in excess of 150° C., and up to 300+° C. The multifunctional coating includes: a) one or more polysilazanes (i.e., a group of silicon-based polymers) that include inorganic and/or organic functionalized polysilazane; b) one or more secondary polymeric additives one or more secondary polymeric additives (e.g., siloxane compounds and/or polysilane compounds); c) one or more optional functionalized nanoparticles and/or fillers; d) one or more optional additive polymers that include: i) Polysulfones (PSF) such as Polyethersulfone (PES) and/or Polyphenylene sulfide (PPS); ii) Polyimides (PI); iii) Polybenzimidazole (PBI); iv) Polybenzoxazoles (PBO); and/or v) fluoropolymers including Polytetrafluoroethylene (PTFE), Polyvinylidene fluoride or polyvinylidene difluoride (PVDF), Fluorinated ethylene propylene (FEP), and/or hexafluoropropylene (HFP); e) one or more optional additives (e.g., biocide, foaming agent, surface tension agent, pigment, curing agent, surface friction reducing agent, stabilizers, flexibilizers, inhibitors, flow control agents, anti-oxidants, degassing agents, dyes, coupling agent, dispersing agents, catalyst and/or hardeners; etc.); and f) one or more optional solvents; and which multifunctional coating is formulated such that it can optionally i) function as a high-temperature insulator, ii) have high elongation and/or improved hydrolytic stability, iii) have extreme weather resistance, iv) have high chemical resistance, v) have high impact and/or abrasion resistance, and/or vi) have improved thermal cycling resistance.