C09J2203/366

REPOSITIONABLE ADHESIVE ARTICLES FOR STRETCH RELEASE REMOVAL

The present disclosure relates to adhesive article that include a first, stretch releasable adhesive and patterned adhesive elements on, within, or partially embedded in a surface of the adhesive. The adhesive elements can act as spacers between the adhesive surface and the mounting surface to prevent full contact and wet out of the first adhesive, whereby the article can be removed from the wall and placed at a new location without damage to the wall surface or the article. Once the final location is selected, the separation created by the engineered elements can be overcome by applying sufficient pressure; the first adhesive can contact and adhere more permanently to the wall. Thus, a stretch releasable adhesive articles of the present disclosure can move freely relative to the desired mounting surface, while developing additional tack and holding power after sufficient pressure is applied.

SURFACE COVERING SYSTEM AND METHOD AND APPARATUS FOR COVERING A SURFACE
20220032579 · 2022-02-03 ·

Described herein is a method of covering a surface using a surface covering system. The surface may be a floor, a wall, or a ceiling. In one embodiment, the surface covering system includes a plurality of panels and an adhesive tape that is configured to detachably couple the panels to the surface. The adhesive tape may include a substrate-side adhesive component, a panel-side adhesive component, and a release component between the substrate-side and panel-side adhesive components. The panels may be detachably coupled to the substrate by the adhesive tape such that at least one adhesive layer of the substrate-side adhesive component is adhered to the substrate, at least one adhesive layer of the panel-side adhesive component is adhered to the rear surfaces of the panels, and the release component is between the substrate-side adhesive component and the panel-side adhesive component.

Surface covering system and method and apparatus for covering a surface
11186065 · 2021-11-30 · ·

A surface covering system, a method of covering a surface, and an apparatus for covering a surface. The surface may be a floor, a wall, or a ceiling. In one embodiment, the surface covering system includes a plurality of panels and an adhesive tape that is configured to detachably couple the panels to the surface. The adhesive tape may include a substrate-side adhesive component, a panel-side adhesive component, and a release component between the substrate-side and panel-side adhesive components. The panels may be detachably coupled to the substrate by the adhesive tape such that at least one adhesive layer of the substrate-side adhesive component is adhered to the substrate, at least one adhesive layer of the panel-side adhesive component is adhered to the rear surfaces of the panels, and the release component is between the substrate-side adhesive component and the panel-side adhesive component.

ADJUSTABLE ADHESIVE ARTICLES WITH PERMISSIBLE MOVEMENT PARALLEL TO BONDING PLANE

The present disclosure provides adhesive mounting articles that permit sliding movement along a primary path, even while the article is fixed between a mounting object and a mounting surface. The adhesive articles can allow user precise control over the location and orientation of his or her mounting object, particularly frames.

TACKIFIED AND FILLED SILICONE ADHESIVE COMPOSITIONS

The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer, silicone polyurea block copolymer, and/or an addition cure silicone, a silicate tackifying resin, and inorganic particle filler. The filler is typically fumed silica. Some embodiments of the adhesive composition include at least one of a polydiorganosiloxane polyoxamide copolymer, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in between about 0.1 wt % and about 20 wt %; a silicone polyurea block copolymer, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in an amount between about 0.1 wt % and about 20 wt %; and an addition cure silicone, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in an amount between about 0.1 wt % and about 20 wt %.

Attachment structure
11125267 · 2021-09-21 · ·

An attachment structure includes a main body and a first adhesive layer. The main body has an upper side as a first side and a lower side as a second side. The first adhesive layer is selectively disposed on one of the first and second sides. The first adhesive layer has multiple first passages. The first passages divide the first adhesive layer into multiple first adhesive blocks. By means of the first passages of the first adhesive layer, when the main body is attached to another unit, the main body can be more easily and tightly attached to the unit without producing any void or blister.

Surface covering system and method and apparatus for covering a surface
11845258 · 2023-12-19 · ·

Described herein is a method of covering a surface using a surface covering system. The surface may be a floor, a wall, or a ceiling. In one embodiment, the surface covering system includes a plurality of panels and an adhesive tape that is configured to detachably couple the panels to the surface. The adhesive tape may include a substrate-side adhesive component, a panel-side adhesive component, and a release component between the substrate-side and panel-side adhesive components. The panels may be detachably coupled to the substrate by the adhesive tape such that at least one adhesive layer of the substrate-side adhesive component is adhered to the substrate, at least one adhesive layer of the panel-side adhesive component is adhered to the rear surfaces of the panels, and the release component is between the substrate-side adhesive component and the panel-side adhesive component.

MOUNT TAPE HAVING AN INNER SUPPORT LAYER BETWEEN ADHESIVE LAYERS FOR SEMICONDUCTOR DEVICE ASSEMBLY
20240063047 · 2024-02-22 ·

Implementations described herein relate to a mount tape and methods of using the mount tape for semiconductor device manufacturing. The mount tape may include a first adhesive layer configured for release at a first stage of a semiconductor device manufacturing process, a second adhesive layer configured for release at a second stage of the semiconductor device manufacturing process, and an inner support layer positioned between the first adhesive layer and the second adhesive layer and configured for removal during the semiconductor device manufacturing process.

ATTACHMENT STRUCTURE
20190368534 · 2019-12-05 ·

An attachment structure includes a main body and a first adhesive layer. The main body has an upper side as a first side and a lower side as a second side. The first adhesive layer is selectively disposed on one of the first and second sides. The first adhesive layer has multiple first passages. The first passages divide the first adhesive layer into multiple first adhesive blocks. By means of the first passages of the first adhesive layer, when the main body is attached to another unit, the main body can be more easily and tightly attached to the unit without producing any void or blister.

SURFACE COVERING SYSTEM AND METHOD AND APPARATUS FOR COVERING A SURFACE
20190270275 · 2019-09-05 · ·

A surface covering system, a method of covering a surface, and an apparatus for covering a surface. The surface may be a floor, a wall, or a ceiling. In one embodiment, the surface covering system includes a plurality of panels and an adhesive tape that is configured to detachably couple the panels to the surface. The adhesive tape may include a substrate-side adhesive component, a panel-side adhesive component, and a release component between the substrate-side and panel-side adhesive components. The panels may be detachably coupled to the substrate by the adhesive tape such that at least one adhesive layer of the substrate-side adhesive component is adhered to the substrate, at least one adhesive layer of the panel-side adhesive component is adhered to the rear surfaces of the panels, and the release component is between the substrate-side adhesive component and the panel-side adhesive component.