An adhesive sheet set including a pair of adhesive sheets respectively including an adhesive layer capable of being cured and adhered by being in contact with each other, and a method for producing a product using the same. An adhesive sheet set including a first adhesive sheet and a second adhesive sheet, wherein the first adhesive sheet includes a first separator and a first adhesive layer provided on one surface of the first separator, the second adhesive sheet includes a second separator and a second adhesive layer provided on one surface of the second separator, and the first adhesive sheet and the second adhesive sheet are configured to be cured and adhered by the first adhesive layer and the second adhesive layer being in contact with each other.

The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.

The invention relates to an activatable adhesive label comprising a flexible web-shaped viewing material. At least one adhesive layer made of a moisture-activatable adhesive that is not adhesive in the dry state is applied onto one side of the flexible viewing material, wherein at least one central layer is provided which is designed to be adhesive and which is arranged between the viewing material and the adhesive layer.

A multilayer adhesive tape in which an interface separation between layers does not occur even at in extremely low temperature atmosphere is provided. The multilayer adhesive tape sequentially includes: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer, in which attaching force among the first outer adhesive layer, the intermediate adhesive layer, and the second outer adhesive layer is maintained after the multilayer adhesive tape is treated in liquefied nitrogen for 15 seconds.

Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection includes a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component. A thickness of the first adhesive layer is 5 μm or less.

The present disclosure relates to a pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer comprising a hollow non-porous particulate filler material, wherein the surface of the hollow non-porous particulate filler material is provided with a hydrophobic surface modification. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly.

The invention relates to adhesive strips consisting of at least four, particularly precisely four layers, comprising: a layer A having an upper side and a lower side consisting of a foamed adhesive substance containing a self-adhesive acrylate substance; a layer B consisting of a film carrier, layer B being arranged on the lower side of layer A, at least the main surface which faces layer A, preferably both main surfaces of the film carrier, being etched, the surface of layer A and the surface of layer B being in direct contact with each other; a layer C consisting of a self-adhesive substance, arranged on the upper side of layer A and containing a self-adhesive acrylate substance; and a layer D consisting of a self-adhesive substance, arranged on the side of layer B opposite layer A and containing a self-adhesive acrylate substance.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

A multilayer adhesive tape is provided, including: a first outer adhesive layer; an intermediate adhesive layer; and a second outer adhesive layer sequentially. At least one of the first outer adhesive layer and the second outer adhesive layer includes a cured product of an outer adhesive composition including a high molecular weight prepolymer having a weight average molecular weight of 100,000 g/mol or more and 1,500,000 g/mol or less and a low molecular weight prepolymer having a weight average molecular weight of 1,000 g/mol or more and 80,000 g/mol or less.

A double-sided optically clear adhesive is provided. The double-sided optically clear adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer includes a first resin and a first thermal-crosslinking agent. The first resin includes a hydroxyl group. The first thermal-crosslinking agent includes a first group. The second adhesive layer includes a second resin and a second thermal-crosslinking agent. The second resin includes a hydroxyl group. The second thermal-crosslinking agent includes a second group. The ratio of the equivalent number of the first group of the first thermal-crosslinking agent to the equivalent number of the hydroxyl group of the first resin is represented by r1. The ratio of the equivalent number of the second group of the second thermal-crosslinking agent to the equivalent number of the hydroxyl group of the second resin is represented by r2, wherein r1<r2≤0.8 and r2−r1≤0.025.