A method of producing a connected body, containing: disposing an adhesive film between a first electronic member having a first electronic electrode and a second electronic member having a second electrode; and pressure-bonding the second electronic member to the first electronic member via the adhesive film so that the second electrode is electrically connected to the first electrode; wherein the first electronic member has an indented surface, the first electrode is provided in a depressed portion of the indented surface, the second electrode has a substantially flat surface having an area larger than an area of the first electrode, the adhesive film contains: first conductive particles that are dendritic conductive particles; and second conductive particles containing a non-conductive core and a conductive layer provided on the core, and the second conductive particles have an average particle diameter of not less than a depth of the depressed portion.

The instant disclosure describes example techniques for bonding multiple metal structures prior or subsequent to application of a protective coating (e.g., an electrocoating or e-coating) to the structures. In certain aspects, the structures may include one or more attachment points for attaching a single structure or multiple structures bonded together to a clamp or other suitable means for applying an electrical current to the structure(s).

Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to heat or electromagnetic energy. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a shape memory material. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

The insulation adhesive film material is composed of a three-layer structure, its insulation polymer composite is supported by a thin film material, and a surface of the insulation polymer composite is covered with a layer of protective film. A release force of a support film is 25-60 μN/mm, and a release force of the protective film is 2-60 μN/mm. A thickness of the insulation polymer composite is 1-300 μm. The insulation adhesive film material is prepared as follows: after a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a molding auxiliary agent, and a solvent are mixed, dispersion technologies such as ball milling, sand milling, ultrasound are conducted to prepare an electronic paste of the insulation polymer composite, and the electronic paste is then applied to a surface of a support film material, and bonded with the protective film to form the insulation adhesive film material.

The present invention relates to an elongated elastic seam tape comprising an elongated elastic conductor as well as to a method of manufacturing such an elongated elastic seam tape.

An electrical steel strip or sheet with a thermosetting water-based hot-melt adhesive varnish layer provided on at least one of its flat sides, a method for producing such an electrical steel strip or sheet, and a laminated core made therefrom are disclosed. In order to produce a particularly storable and aging-stable thermosetting hot-melt adhesive varnish layer on the electrical steel strip or sheet in the B state, it is proposed for the stoichiometric ratio of the epoxy groups of the epoxy resin or epoxy resins relative to the hydrogen atoms of the at least two amino groups of the hardener that is latent at room temperature to lie in the range from 1.33:1 to 5:1.

This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.

The present application discloses a frame sealant and its preparation method and display panel. The frame sealant of the present application includes frame sealant glue and conductive fibers dispersed in the frame sealant glue, and the conductive fibers have a three-dimensional helical structure. The frame sealant of the present application has excellent electrical conductivity, high packaging quality, excellent toughness and packaging bonding strength after curing, and improves the anti-separation ability of the two substrates of the box. The preparation method of the frame sealant of the present application can ensure that the prepared frame sealant has stable performance and high efficiency. The display panel contains the frame sealant of the present application, with stable display and long service life.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

The present disclosure relates to an anisotropic conductive film capable of electrode bonding even at a low temperature and maintaining excellent conductivity and flexibility, a manufacturing method thereof, and a display device using the same. The anisotropic conductive film contains conductive microcapsules including a liquid metal in a binder layer.