C09J2301/408

DYNAMICALLY CROSSLINKED TOUGH ADHESIVE WITH RECYCLABILITY
20230044696 · 2023-02-09 ·

A crosslinked adhesive composition comprising: (i) a polymer; (ii) solid particles embedded within the polymer; and (iii) a multiplicity of boronate linkages crosslinking between the polymer and solid particles, wherein the boronate linkages have the formula

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wherein the polymer and particles are connected to each other through the boronate linkages, and the crosslinked adhesive composition has an ability to bond surfaces and a further ability to thermally debond and rebond the surfaces. Also described herein is a method of bonding first and second surfaces together, the method comprising placing the above-described crosslinked adhesive composition onto the first surface and pressing the second surface onto the crosslinked adhesive composition on the first surface.

ANISOTROPIC CONDUCTIVE FILM

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

ACRYLIC ADHESIVE SHEET, MEDICAL ADHESIVE TAPE, AND METHOD FOR MANUFACTURING THE SAME

Provided are: an acrylic adhesive sheet having a porous structure including a plurality of pores and having a water vapor transmission rate of 2,000 g/m.sup.2.Math.24 h to 3,500 g/m.sup.2.Math.24 h at 24° C. and 25% RH, and a porosity of 10% to 60%; and a medical adhesive tape including the same.

ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection includes a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component. A thickness of the first adhesive layer is 5 μm or less.

ELECTRICALLY CONDUCTIVE MASKING TAPE
20230002646 · 2023-01-05 ·

Electrically conductive masking tapes include an electrically conductive backing and an electrically conductive pressure sensitive adhesive layer. The pressure sensitive adhesive contains an acrylate-based copolymeric matrix, a crosslinker, an electrically conductive filler, and at least one antioxidant. The acrylate-based copolymeric matrix is the reaction product of a polymerizable mixture including at least one first alkyl(meth)acrylate monomer with a homopolymer Tg of less than −50° C., and at least one hydroxyl-functional alkyl(meth)acrylate with a homopolymer Tg of less than −10° C. The electrically conductive tape is capable of being laminated to and cleanly removed from a substrate surface, after being subjected to harsh conditions such as plasma vapor deposition conditions.

ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

CONNECTOR PRODUCTION METHOD AND ADHESIVE FILM

A method of producing a connected body, containing: disposing an adhesive film between a first electronic member having a first electronic electrode and a second electronic member having a second electrode; and pressure-bonding the second electronic member to the first electronic member via the adhesive film so that the second electrode is electrically connected to the first electrode; wherein the first electronic member has an indented surface, the first electrode is provided in a depressed portion of the indented surface, the second electrode has a substantially flat surface having an area larger than an area of the first electrode, the adhesive film contains: first conductive particles that are dendritic conductive particles; and second conductive particles containing a non-conductive core and a conductive layer provided on the core, and the second conductive particles have an average particle diameter of not less than a depth of the depressed portion.

Coating Tape for Inorganic Layer for Electrode and Method of Manufacturing the Same

The present invention relates to a coating tape and a method of manufacturing the same. More particularly, the present invention relates to a coating tape in which an inorganic layer formed on one surface or both surfaces of an electrode is formed in the form of an adhesive tape so as to be attached to a battery, and a method of manufacturing the same.

ADHESIVE COMPOSITION, ADHESIVE AGENT, ADHESIVE TAPE, AND AIRTIGHT WATERPROOF ADHESIVE TAPE
20230002649 · 2023-01-05 · ·

An adhesive composition that is excellent in both adhesiveness and a holding force while having high flame retardancy. The adhesive composition contains an acrylic resin (A) containing a (meth)acrylic acid monomer (a1) unit and a hydroxyl group-containing monomer (a2) unit, an epoxy crosslinking agent (b1), an isocyanate crosslinking agent (b2), and a flame retardant (C).

Pressure sensitive adhesive assembly comprising filler material

The present disclosure relates to a pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer comprising a hollow non-porous particulate filler material, wherein the surface of the hollow non-porous particulate filler material is provided with a hydrophobic surface modification. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly.